Patents by Inventor Lau Choong Keong

Lau Choong Keong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
    Publication number: 20120043655
    Abstract: A method of fabricated a wafer level package is described. In one embodiment, the method includes fabricating at least one active device on a semiconductor wafer that has not been singulated, with the active device having a plurality of bonding pads exposed at an upper surface of the wafer. Prior to singulating the semiconductor wafer, a plurality of corresponding stud bumps on the plurality of bonding pads with a wire bonding tool are formed. Thereafter, a molding encapsulation layer is applied over the semiconductor wafer leaving an upper portion of each of the plurality of stud bumps exposed.
    Type: Application
    Filed: November 1, 2011
    Publication date: February 23, 2012
    Applicant: Carsem (M) Sdn. Bhd.
    Inventors: Lily Khor, Yong Lam Wai, Lau Choong Keong
  • Wafer level package using stud bump coated with solder
    Patent number: 8071470
    Abstract: A method of fabricated a wafer level package is described. In one embodiment, the method includes fabricating at least one active device on a semiconductor wafer that has not been singulated, with the active device having a plurality of bonding pads exposed at an upper surface of the wafer. Prior to singulating the semiconductor wafer, a plurality of corresponding stud bumps on the plurality of bonding pads with a wire bonding tool are formed. Thereafter, a molding encapsulation layer is applied over the semiconductor wafer leaving an upper portion of each of the plurality of stud bumps exposed.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: December 6, 2011
    Assignee: Carsem (M) SDN. BHD.
    Inventors: Lily Khor, Yong Lam Wai, Lau Choong Keong