Patents by Inventor Lau Kam Chuan

Lau Kam Chuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for encapsulating lead frame packages
    Patent number: 7214562
    Abstract: A method of encapsulating a plurality of IC chips attached to a lead frame strip that includes an outer frame and a plurality of vertical and horizontal connecting bars attached to the outer frame in a manner that defines a plurality of inner frames arranged in a matrix pattern within the outer frame, each inner frame including an area where an IC chip from the plurality of IC chips is attached.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: May 8, 2007
    Assignee: Carsem (M) Sdn. Bhd.
    Inventors: Richard Yee Mow Lum, Wong Chee Heng, Lau Kam Chuan, Goh Kok Siang, Yip Chee Sang