Patents by Inventor Lau Kwang

Lau Kwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip package using no-flow underfill and method of fabrication
    Publication number: 20050087883
    Abstract: A design and method of fabrication for a semiconductor package is described. A solder bumped semiconductor chip is assembled to a metallized package substrate utilizing the solder bumps. The interconnecting solder bumps are properly constrained at assembly by the introduction of a no-flow underfill between the chip and the substrate. The no-flow underfill constrains the solder of the solder bumps so as to maintain the desired size and shape.
    Type: Application
    Filed: October 22, 2003
    Publication date: April 28, 2005
    Inventors: Tan Hwee, Roman Perez, Antonio Dimaano, Lau Kwang, Alex Chew