Abstract: A double sided cooled power module package having a single phase leg topology includes two IGBT and two diode semiconductor dies. Each IGBT die is spaced apart from a diode semiconductor die, forming a switch unit. Two switch units are placed in a planar face-up and face-down configuration. A pair of DBC or other insulated metallic substrates is affixed to each side of the planar phase leg semiconductor dies to form a sandwich structure. Attachment layers are disposed on outer surfaces of the substrates and two heat exchangers are affixed to the substrates by rigid bond layers. The heat exchangers, made of copper or aluminum, have passages for carrying coolant. The power package is manufactured in a two-step assembly and heating process where direct bonds are formed for all bond layers by soldering, sintering, solid diffusion bonding or transient liquid diffusion bonding, with a specially designed jig and fixture.

Abstract: This invention teaches methods of making a hermetic terminal assembly comprising the steps of: inserting temporary stops, shims and jigs on the bottom face of a terminal assembly thereby blocking assembly core open passageways; mounting the terminal assembly inside a vacuum chamber using a temporary assembly perimeter seal and flange or threaded assembly interfaces; mixing a seal admixture and hardener in a mixer conveyor to form a polymer seal material; conveying the polymer seal material into a polymer reservoir; feeding the polymer seal material from the reservoir through a polymer outlet valve and at least one polymer outlet tube into the terminal assembly core thereby filling interstitial spaces in the core adjacent to service conduits, temporary stop, and the terminal assembly casing; drying the polymer seal material at room temperature thereby hermetically sealing the core of the terminal assembly; removing the terminal assembly from the vacuum chamber, and; removing the temporary stops, shims.

Abstract: The invention is a direct contact refrigerant cooling system using a refrigerant floating loop having a refrigerant and refrigeration devices. The cooling system has at least one hermetic container disposed in the refrigerant floating loop. The hermetic container has at least one electronic component selected from the group consisting of capacitors, power electronic switches and gating signal module. The refrigerant is in direct contact with the electronic component.

Abstract: A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.

Abstract: A method for cooling vehicle components using the vehicle air conditioning system comprising the steps of: tapping the hot liquid refrigerant of said air conditioning system, flooding a heat exchanger in the vehicle component with said hot liquid refrigerant, evaporating said hot liquid refrigerant into hot vapor refrigerant using the heat from said vehicle component, and returning said hot vapor refrigerant to the hot vapor refrigerant line in said vehicle air conditioning system.

Abstract: A floating loop vehicle component cooling and air-conditioning system having at least one compressor for compressing cool vapor refrigerant into hot vapor refrigerant; at least one condenser for condensing the hot vapor refrigerant into hot liquid refrigerant by exchanging heat with outdoor air; at least one floating loop component cooling device for evaporating the hot liquid refrigerant into hot vapor refrigerant; at least one expansion device for expanding the hot liquid refrigerant into cool liquid refrigerant; at least one air conditioning evaporator for evaporating the cool liquid refrigerant into cool vapor refrigerant by exchanging heat with indoor air; and piping for interconnecting components of the cooling and air conditioning system.

Abstract: A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.

Abstract: This invention teaches methods of making a hermetic terminal assembly comprising the steps of: inserting temporary stops, shims and jigs on the bottom face of a terminal assembly thereby blocking assembly core open passageways; mounting the terminal assembly inside a vacuum chamber using a temporary assembly perimeter seal and flange or threaded assembly interfaces; mixing a seal admixture and hardener in a mixer conveyor to form a polymer seal material; conveying the polymer seal material into a polymer reservoir; feeding the polymer seal material from the reservoir through a polymer outlet valve and at least one polymer outlet tube into the terminal assembly core thereby filling interstitial spaces in the core adjacent to service conduits, temporary stop, and the terminal assembly casing; drying the polymer seal material at room temperature thereby hermetically sealing the core of the terminal assembly; removing the terminal assembly from the vacuum chamber, and; removing the temporary stops, shims.

Abstract: A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.

Abstract: This disclosure provides an integrated thermal management system and methods for managing the cooling of electrical devices and components and the heating and cooling of the passengers' compartment in a hybrid or full electric vehicle to reduce the cost and volume of such systems.

Abstract: This disclosure provides an integrated thermal management system and methods for managing the cooling of electrical devices and components and the heating and cooling of the passengers' compartment in a hybrid or full electric vehicle to reduce the cost and volume of such systems.

Abstract: A multiple zone hermetic inverter/converter chamber for cooling power electronics using direct contact cooling in the liquid refrigerant zone and vapor refrigerant zone located in the hermetic container, and indirect non-contact cooling in the ambient cooling zone located in the interstitial space between the hermetic container and the thermally isolated housing. The ambient cooling zone operates at atmospheric pressure.