Patents by Inventor Laura John

Laura John has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reduction in large particle counts in polishing slurries
    Patent number: 10167415
    Abstract: The present disclosure provides a method for reducing large particle counts (LPCs) in copper chemical mechanical polishing slurry by way of using high purity removal rate enhancer (RRE) in the slurry. The conductivity of the RRE in deionized water solutions correlates very strongly with the number of LPCs in the RRE, and thus in a slurry using the RRE.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: January 1, 2019
    Assignee: FUJIFILM PLANAR SOLUTIONS, LLC
    Inventors: James McDonough, Laura John, Deepak Mahulikar
  • REDUCTION IN LARGE PARTICLE COUNTS IN POLISHING SLURRIES
    Publication number: 20180187048
    Abstract: The present disclosure provides a method for reducing large particle counts (LPCs) in copper chemical mechanical polishing slurry by way of using high purity removal rate enhancer (RRE) in the slurry. The conductivity of the RRE in deionized water solutions correlates very strongly with the number of LPCs in the RRE, and thus in a slurry using the RRE.
    Type: Application
    Filed: February 28, 2018
    Publication date: July 5, 2018
    Inventors: James McDonough, Laura John, Deepak Mahulikar
  • REDUCTION IN LARGE PARTICLE COUNTS IN POLISHING SLURRIES
    Publication number: 20180079931
    Abstract: The present disclosure provides a method for reducing large particle counts (LPCs) in copper chemical mechanical polishing slurry by way of using high purity removal rate enhancer (RRE) in the slurry. The conductivity of the RRE in deionized water solutions correlates very strongly with the number of LPCs in the RRE, and thus in a slurry using the RRE.
    Type: Application
    Filed: November 28, 2017
    Publication date: March 22, 2018
    Inventors: James McDonough, Laura John, Deepak Mahulikar
  • Reduction in large particle counts in polishing slurries
    Patent number: 9914852
    Abstract: The present disclosure provides a method for reducing large particle counts (LPCs) in copper chemical mechanical polishing slurry by way of using high purity removal rate enhancer (RRE) in the slurry. The conductivity of the RRE in deionized water solutions correlates very strongly with the number of LPCs in the RRE, and thus in a slurry using the RRE.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: March 13, 2018
    Assignee: FUJIFILM PLANAR SOLUTIONS, LLC
    Inventors: James McDonough, Laura John, Deepak Mahulikar
  • REDUCTION IN LARGE PARTICLE COUNTS IN POLISHING SLURRIES
    Publication number: 20160053136
    Abstract: The present disclosure provides a method for reducing large particle counts (LPCs) in copper chemical mechanical polishing slurry by way of using high purity removal rate enhancer (RRE) in the slurry. The conductivity of the RRE in deionized water solutions correlates very strongly with the number of LPCs in the RRE, and thus in a slurry using the RRE.
    Type: Application
    Filed: August 19, 2014
    Publication date: February 25, 2016
    Inventors: James McDonough, Laura John, Deepak Mahulikar
  • Wafer carrier and method of material removal from a semiconductor wafer
    Patent number: 6592434
    Abstract: A wafer carrier (300) for a CMP tool is adjustable to provide center fast to edge fast material removal from a semiconductor wafer. The wafer carrier (300) holds the semiconductor wafer without vacuum. The semiconductor wafer is held by a carrier ring (308). An elastically flexed wafer support structure (318) is a support surface for the semiconductor wafer. Elastically flexed wafer support structure (318) can be bowed outward or bowed inward in an infinite number of different contours. The semiconductor wafer conforms to the contour of the elastically flexed wafer support structure (318) when a down force is applied to the wafer carrier (300) during a polishing process. Changing the contour is used to produce different material removal rates across the radius of the semiconductor wafer to increase wafer planarity in a polishing process.
    Type: Grant
    Filed: November 16, 2000
    Date of Patent: July 15, 2003
    Assignee: Motorola, Inc.
    Inventors: James F. Vanell, James A. Grootegoed, Laura John