Abstract: Disclosed are various embodiments for identifying fault injection impact zones. A test for an application can be received from a test service. An application schema can then be created that represents the systems or services that are involved in the execution of the application. Applications with a similar application schema are then identified using a first machine-learning model. A subset of the plurality of applications that have experienced a similar test are then identified with a second machine-learning model. Log files associated with each of the subset of applications are then analyzed to identify errors that occurred during the similar test. Each of the identified errors are then provided to the test service in response to receipt of the test.

Abstract: An apparatus comprises receiving circuitry to receive user information indicative of an inactivity period for one or more video games previously played by a user, prediction circuitry to predict a mitigation action associated with a respective video game of the one or more video games previously played by the user in dependence on at least an inactivity period for the respective video game and generate video game mitigation information for the mitigation action associated with the respective video game, the prediction circuitry comprising one or more trained machine learning models to predict the mitigation action in dependence on at least the inactivity period for the respective video game, and output circuitry to output the video game mitigation information.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer-storage media, for sorting fish in aquaculture. In some implementations, one or more images are obtained of a particular fish within a population of fish. Based on the one or more images of the fish, a data element is determined. The data element can include a first value that reflects a physical characteristic of the particular fish, and a second value that reflects a condition factor of the particular fish. Based on the data element, the fish is classified as a member of a particular subpopulation of the population of fish. An actuator of an automated fish sorter is controlled based on classifying the particular fish as a member of the particular subpopulation of the population of fish.

Abstract: The present disclosure provides a method for reducing large particle counts (LPCs) in copper chemical mechanical polishing slurry by way of using high purity removal rate enhancer (RRE) in the slurry. The conductivity of the RRE in deionized water solutions correlates very strongly with the number of LPCs in the RRE, and thus in a slurry using the RRE.

Abstract: The present disclosure provides a method for reducing large particle counts (LPCs) in copper chemical mechanical polishing slurry by way of using high purity removal rate enhancer (RRE) in the slurry. The conductivity of the RRE in deionized water solutions correlates very strongly with the number of LPCs in the RRE, and thus in a slurry using the RRE.

Abstract: The present disclosure provides a method for reducing large particle counts (LPCs) in copper chemical mechanical polishing slurry by way of using high purity removal rate enhancer (RRE) in the slurry. The conductivity of the RRE in deionized water solutions correlates very strongly with the number of LPCs in the RRE, and thus in a slurry using the RRE.

Abstract: The present disclosure provides a method for reducing large particle counts (LPCs) in copper chemical mechanical polishing slurry by way of using high purity removal rate enhancer (RRE) in the slurry. The conductivity of the RRE in deionized water solutions correlates very strongly with the number of LPCs in the RRE, and thus in a slurry using the RRE.

Abstract: The present disclosure provides a method for reducing large particle counts (LPCs) in copper chemical mechanical polishing slurry by way of using high purity removal rate enhancer (RRE) in the slurry. The conductivity of the RRE in deionized water solutions correlates very strongly with the number of LPCs in the RRE, and thus in a slurry using the RRE.

Abstract: A wafer carrier (300) for a CMP tool is adjustable to provide center fast to edge fast material removal from a semiconductor wafer. The wafer carrier (300) holds the semiconductor wafer without vacuum. The semiconductor wafer is held by a carrier ring (308). An elastically flexed wafer support structure (318) is a support surface for the semiconductor wafer. Elastically flexed wafer support structure (318) can be bowed outward or bowed inward in an infinite number of different contours. The semiconductor wafer conforms to the contour of the elastically flexed wafer support structure (318) when a down force is applied to the wafer carrier (300) during a polishing process. Changing the contour is used to produce different material removal rates across the radius of the semiconductor wafer to increase wafer planarity in a polishing process.