Patents by Inventor Laura May Antoinette Clemente

Laura May Antoinette Clemente has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NO-LEAD INTEGRATED CIRCUIT HAVING AN ABLATED MOLD COMPOUND AND EXTRUDED CONTACTS
    Publication number: 20240105557
    Abstract: An electronic device includes a leadframe including a die pad and contacts, where a die attached is to the die pad. Wire bonds are attached from the die to the contacts and a mold compound overlies the leadframe and encapsulates the die and the wire bonds. The mold compound has angled side surfaces that extend from a top of the mold compound to a bonding surface of the contacts. The contacts extend from the angled side surfaces in a range of approximately 100 to 300 um.
    Type: Application
    Filed: September 23, 2022
    Publication date: March 28, 2024
    Inventors: Laura May Antoinette Clemente, John Carlo Molina