Patents by Inventor Laura May Antoinette Dela Paz Clemente

Laura May Antoinette Dela Paz Clemente has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC DEVICE TOPSIDE COOLING
    Publication number: 20230395471
    Abstract: A method comprises removing a portion of molding compound from a side of a package structure by a laser ablation process to create an opening that exposes a portion of a conductive clip, depositing solder paste on the exposed portion of the conductive clip, and reflowing the solder paste. The laser ablation process in one example is a pulsed laser ablation process that includes raster scanning a laser along a portion of the side of the package structure to create the opening. Depositing the solder paste in one example includes performing a dispense process or a screening process that deposits solder paste in the opening onto the exposed portion of the conductive clip.
    Type: Application
    Filed: August 22, 2023
    Publication date: December 7, 2023
    Inventors: Laura May Antoinette Dela Paz Clemente, James Raymond Maliclic Baello
  • Electronic device topside cooling
    Patent number: 11742266
    Abstract: A method comprises removing a portion of molding compound from a side of a package structure by a laser ablation process to create an opening that exposes a portion of a conductive clip, depositing solder paste on the exposed portion of the conductive clip, and reflowing the solder paste. The laser ablation process in one example is a pulsed laser ablation process that includes raster scanning a laser along a portion of the side of the package structure to create the opening. Depositing the solder paste in one example includes performing a dispense process or a screening process that deposits solder paste in the opening onto the exposed portion of the conductive clip.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: August 29, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Laura May Antoinette Dela Paz Clemente, James Raymond Maliclic Baello
  • Semiconductor device package with a cap to selectively exclude contact with mold compound
    Patent number: 11276615
    Abstract: A described example includes: a die with an active surface; a cap mounted over a portion of the active surface of the die; and mold compound covering the cap and covering portions of the die, the cap excluding the mold compound from contact with the portion of the active surface of the die.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: March 15, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Laura May Antoinette Dela Paz Clemente, Jerry Gomez Cayabyab
  • ELECTRONIC DEVICE TOPSIDE COOLING
    Publication number: 20210183751
    Abstract: A method comprises removing a portion of molding compound from a side of a package structure by a laser ablation process to create an opening that exposes a portion of a conductive clip, depositing solder paste on the exposed portion of the conductive clip, and reflowing the solder paste. The laser ablation process in one example is a pulsed laser ablation process that includes raster scanning a laser along a portion of the side of the package structure to create the opening. Depositing the solder paste in one example includes performing a dispense process or a screening process that deposits solder paste in the opening onto the exposed portion of the conductive clip.
    Type: Application
    Filed: December 12, 2019
    Publication date: June 17, 2021
    Applicant: Texas Instruments Incorporated
    Inventors: Laura May Antoinette Dela Paz Clemente, James Raymond Maliclic Baello
  • SEMICONDUCTOR DEVICE PACKAGE WITH A CAP TO SELECTIVELY EXCLUDE CONTACT WITH MOLD COMPOUND
    Publication number: 20200013688
    Abstract: A described example includes: a die with an active surface; a cap mounted over a portion of the active surface of the die; and mold compound covering the cap and covering portions of the die, the cap excluding the mold compound from contact with the portion of the active surface of the die.
    Type: Application
    Filed: September 17, 2019
    Publication date: January 9, 2020
    Inventors: Laura May Antoinette Dela Paz Clemente, Jerry Gomez Cayabyab
  • Semiconductor device package with a cap to selectively exclude contact with mold compound
    Patent number: 10418294
    Abstract: A described example includes: a die with an active surface; a cap mounted over a portion of the active surface of the die; and mold compound covering the cap and covering portions of the die, the cap excluding the mold compound from contact with the portion of the active surface of the die.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: September 17, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Laura May Antoinette Dela Paz Clemente, Jerry Gomez Cayabyab