Abstract: A custom platform is developed that is capable of culturing endothelial cells three-dimensionally while inducing physiological stimuli on the cells. A model includes serum-free conditions, allowing more quantifiable angiogenesis studies that investigate the dose dependent effects of various growth factors. Angiogenesis plays a critical role during development, wound healing, and disease; therefore, further investigation of the pathway has broad implications. Also, the development of in vitro vascularized tissue models via angiogenesis provides the ability to investigate endothelial responses after exposure to nanoparticles and mechanisms of drug delivery.

Abstract: The present invention relates generally to the fields of medicine, immunology, and cancer biology. More particularly, it concerns antibodies that target HSP70 and methods of their use. Provided herein are agents such as antibodies that target HSP70. Methods of treating cancer are provided, comprising administering to a patient in need thereof an effective amount of an HSP70-targeting agent such as an HSP70-specific antibody. The HSP70-specific antibody may enhance uptake of HSP70 by antigen presenting cells.

Abstract: Various aspects disclosed relate to an antibiotic adjuvant. The adjuvant includes the structure according to Formula I: In Formula I, R can be selected from: a substituted or unsubstituted (C1-C13)hydrocarbyl; the structure according to Formula II the structure according to Formula III the structure according to Formula IV and n is in a range of 1-10.

Abstract: In one aspect, compounds and methods are described herein for treating gram negative bacteria having resistance to cationic antimicrobial peptides. In some embodiments, for example, compounds of formula I are provided. In another aspect, a treatment for a gram negative bacterial infection comprises a cationic antimicrobial protein (CAP) in conjunction with a compound of formula I.

Abstract: The application discloses peptides capable of preventing or treating fungal disease, including fungal allergy disease.

Abstract: An extendable comfort razor comprising: an elongated body, where the elongated body extends the length of the extendable comfort razor; a handle at a top end of the elongated body, where the handle curves from the elongated body; a razor portion attached to a bottom end of the elongated body, where the razor portion slides in and out of the elongated body and where the razor portion receives a replacement cartridge; a set of adjustment notches along a middle portion of the elongated body; and a set of buttons along the razor portion wherein at least one of the buttons engage at least one of the adjustment notches to lock the elongated body at a desired length thereby allowing the replacement cartridge to reach a desired portion on a body of a user.

Abstract: A method and system for supporting simultaneous operation of operating systems on a single integrated circuit. The system includes a supervisory operating system (SOS) managing execution of instructions, each instruction being executable under one of the operating systems; registers grouped into multiple sets of registers, each set maintaining an identity of one of the operating systems; and a dispatcher capable of dispatching an instruction and a tag attached to the instruction, the tag identifying one of the operating systems and the instruction to be executed under the identified operating system to access one of the registers. One or more of the registers are utilized when the instruction is executed, and are included in a single set of the multiple sets of registers. The single set maintains the identity of the operating system identified by the tag, and each of the one or more registers includes an identifier matching the tag.

Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.

Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.

Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.

Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.