Patents by Inventor Laura S. Mortimer

Laura S. Mortimer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BALL GRID ARRAY SOLDER ATTACHMENT
    Publication number: 20180350767
    Abstract: Reflow Grid Array (RGA) technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a ball grid array (BGA) package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is application of solder to the RGA interposer. Technical solutions described herein provide processes and equipment for application of solder and formation of solder balls to connect an RGA interposer to a BGA package.
    Type: Application
    Filed: August 3, 2018
    Publication date: December 6, 2018
    Inventors: Jonathon R. Carstens, Michael S. Brazel, Russell S. Aoki, Laura S. Mortimer
  • BULK SOLDER REMOVAL ON PROCESSOR PACKAGING
    Publication number: 20170179066
    Abstract: Reflow Grid Array technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a BGA package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is solder cleaning and removal when removing a BGA package. Technical solutions described herein provide processes and equipment for bulk solder removal from a BGA package that can be executed in the field.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 22, 2017
    Inventors: Russell S. Aoki, John W. Jaeger, Michael S. Brazel, Daniel P. Carter, Anthony P. Valpiani, Michael R. Hui, Rashelle Yee, Joseph J. Jasniewski, Shelby A. Ferguson, Thomas A. Boyd, Jonathan W. Thibado, Penny K. Woodcock, Rachel G. Taylor, Laura S. Mortimer
  • BALL GRID ARRAY SOLDER ATTACHMENT
    Publication number: 20170179069
    Abstract: Reflow Grid Array (RGA) technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a ball grid array (BGA) package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is application of solder to the RGA interposer. Technical solutions described herein provide processes and equipment for application of solder and formation of solder balls to connect an RGA interposer to a BGA package.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 22, 2017
    Inventors: Jonathon R. Carstens, Michael S. Brazel, Russell S. Aoki, Laura S. Mortimer