Patents by Inventor Laura Serianni

Laura Serianni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Self-aligned copper silicide formation for improved adhesion/electromigration
    Patent number: 6818992
    Abstract: A method for forming a semiconductor structure includes supplying a structure having an exposed last metalization layer, cleaning the last metalization layer, forming a silicide in a top portion of the last metalization layer and forming a terminal over the silicide.
    Type: Grant
    Filed: September 21, 2000
    Date of Patent: November 16, 2004
    Assignee: International Business Machines Corporation
    Inventors: Douglas S. Armbrust, Margaret L. Gibson, Laura Serianni, Eric J. White
  • Self-aligned copper silicide formation for improved adhesion/electromigration
    Patent number: 6251775
    Abstract: A method for forming a semiconductor structure includes supplying a structure having an exposed last metalization layer, cleaning the last metalization layer, forming a silicide in a top portion of the last metalization layer and forming a terminal over the silicide.
    Type: Grant
    Filed: April 23, 1999
    Date of Patent: June 26, 2001
    Assignee: International Business Machines Corporation
    Inventors: Douglas S. Armbrust, Margaret L. Gibson, Laura Serianni, Eric J. White