Abstract: The invention relates to a method for depositing an electrical insulation layer on an electrochemical cell including a lower wall, a side wall and an upper wall on which a positive terminal and a negative terminal are arranged, the side wall and the upper wall being connected by a peripheral edge. The deposition method includes a step of depositing an electrical insulation layer during which the electrical insulation layer is deposited on the lower wall, the side wall, and only on one border of the upper wall the border extending from the peripheral edge toward the interior of the upper wall over a distance d, so as to form an electrical insulation strip covering the border and surrounding a central zone of the upper wall.

Abstract: A glass article with a solar-control function includes at least one glass substrate and a stack of layers deposited on at least one face of the substrate. The stack of layers includes a layer of titanium oxynitride of general formula TiNxOy, in which 1.00<x<1.20 and in which 0.01<y<0.10. The stack of layers further includes layers of dielectric materials and optionally of metallic or nitrided layers based on chromium, nickel, titanium, niobium or a mixture of at least two of these elements.

Abstract: A material includes a transparent substrate coated with a stack of thin layers including at least one functional coating including at least one silver-based metal functional layer, and at least one niobium-based metal or nitride functional layer.

Abstract: A glass article with a solar-control function includes at least one glass substrate and a stack of layers deposited on at least one face of the substrate. The stack of layers includes a layer of titanium oxynitride of general formula TiNxOy, in which 1.00<x<1.20 and in which 0.01<y<0.10. The stack of layers further includes layers of dielectric materials and optionally of metallic or nitrided layers based on chromium, nickel, titanium, niobium or a mixture of at least two of these elements.

Abstract: A substrate is coated on one face with a thin-film multilayer including at least one metal functional film based on silver or made of silver having a thickness e of between 7 nm and 20 nm inclusive of these values, and two antireflection coatings each including at least one antireflection film. The functional film is placed between the two antireflection coatings. The multilayer includes an upper discontinuous metal film having a thickness e? of between 0.5 nm and 5 nm inclusive of these values. The upper discontinuous metal film is located above the only or last metal functional film as counted starting from the face.

Abstract: A material includes a transparent substrate coated with a stack of thin layers including at least one functional coating including at least one silver-based metal functional layer, and at least one niobium-based metal or nitride functional layer.

Abstract: A substrate is coated on one face with a thin-film multilayer including at least one metal functional film based on silver or made of silver having a thickness e of between 7 nm and 20 nm inclusive of these values, and two antireflection coatings each including at least one antireflection film. The functional film is placed between the two antireflection coatings. The multilayer includes an upper discontinuous metal film having a thickness e? of between 0.5 nm and 5 nm inclusive of these values. The upper discontinuous metal film is located above the only or last metal functional film as counted starting from the face.