Patents by Inventor Laure M. Maquet

Laure M. Maquet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low profile copper foil and process and apparatus for making bondable metal foils
    Patent number: 5215646
    Abstract: A one-step electrolytic process and apparatus for producing metal foil, e.g., copper foil having a low profile treated surface for use in fabricating printed circuit boards, wherein primary foil is electrodeposited on a cathode in a first electrodeposition zone using a first current density while circulating electrolyte therein under turbulent flow conditions, and micronodules of the metal are electrodeposited on a matte surface of the primary foil in a second electrodeposition zone using a second current density greater than the first current density while circulating electrolyte therein under laminar flow conditions. A grain refining agent is employed in the electrolyte to further improve the quality. The process provides a low profile finished foil having a high peel strength.
    Type: Grant
    Filed: May 6, 1992
    Date of Patent: June 1, 1993
    Assignee: Circuit Foil USA, Inc.
    Inventors: Adam M. Wolski, Kurt Acx, Michel Mathieu, Laure M. Maquet