Patents by Inventor Lauren Akemi Hamamoto Donegan RYAN

Lauren Akemi Hamamoto Donegan RYAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal layering construction in flex/rigid-flex printed circuits
    Patent number: 10420208
    Abstract: A printed circuit board is provided. The printed circuit board includes a flexible region. The flexible region includes a first copper layer, a first dielectric layer, a second copper layer, an adhesive layer, and a first metal layer, in the order listed. The first metal layer includes a metal film having a tensile strength greater than the first and second copper layers and greater than the dielectric layer.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: September 17, 2019
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Jonathan Bernard Lester, Bhret Robert Graydon, Matthew David Mickelson, Lauren Akemi Hamamoto Donegan Ryan
  • METAL LAYERING CONSTRUCTION IN FLEX/RIGID-FLEX PRINTED CIRCUITS
    Publication number: 20190075651
    Abstract: A printed circuit board is provided. The printed circuit board includes a flexible region. The flexible region includes a first copper layer, a first dielectric layer, a second copper layer, an adhesive layer, and a first metal layer, in the order listed. The first metal layer includes a metal film having a tensile strength greater than the first and second copper layers and greater than the dielectric layer.
    Type: Application
    Filed: September 6, 2017
    Publication date: March 7, 2019
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Jonathan Bernard LESTER, Bhret Robert GRAYDON, Matthew David MICKELSON, Lauren Akemi Hamamoto Donegan RYAN