Patents by Inventor Laurence Dulmage

Laurence Dulmage has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Linear wafer drive for handling wafers during semiconductor fabrication
    Patent number: 10163667
    Abstract: A modular cluster tool is disclosed. According to one embodiment, a system, comprises a wafer transfer station that includes a first vacuum chamber that stores a plurality of semiconductor wafers. The system also includes an equipment front end module interface, and two or more shuttle lock interfaces.
    Type: Grant
    Filed: March 24, 2008
    Date of Patent: December 25, 2018
    Assignee: Brooks Automation, Inc.
    Inventors: J. B. Price, Jed Keller, Laurence Dulmage, David Adams, Eric Winger, Lawrence Wise
  • METHOD AND APPARATUS FOR SEMICONDUCTOR PROCESSING
    Publication number: 20100221915
    Abstract: A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.
    Type: Application
    Filed: May 7, 2010
    Publication date: September 2, 2010
    Inventors: J.B. Price, Jed Keller, Laurence Dulmage, David Cheng
  • Method and apparatus for semiconductor processing
    Patent number: 7748944
    Abstract: A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: July 6, 2010
    Assignee: Crossing Automation, Inc.
    Inventors: JB Price, Jed Keller, Laurence Dulmage, David Cheng
  • MODULAR CLUSTER TOOL
    Publication number: 20080232934
    Abstract: A modular cluster tool is disclosed. According to one embodiment, a system, comprises a wafer transfer station that includes a first vacuum chamber that stores a plurality of semiconductor wafers. The system also includes an equipment front end module interface, and two or more shuttle lock interfaces.
    Type: Application
    Filed: March 24, 2008
    Publication date: September 25, 2008
    Inventors: J.B. Price, Jed Keller, Laurence Dulmage, David Adams, Eric Winger, Lawrence Wise
  • A METHOD AND APPARATUS FOR SEMCONDUCTOR PROCESSING
    Publication number: 20080089774
    Abstract: A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.
    Type: Application
    Filed: October 30, 2007
    Publication date: April 17, 2008
    Inventors: J.B. Price, Jed Keller, Laurence Dulmage, David Cheng
  • METHOD AND APPARATUS FOR SEMICONDUCTOR PROCESSING
    Publication number: 20080073031
    Abstract: A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.
    Type: Application
    Filed: October 30, 2007
    Publication date: March 27, 2008
    Inventors: J.B. Price, Jed Keller, Laurence Dulmage, David Cheng
  • Method and apparatus for semiconductor processing
    Publication number: 20050194096
    Abstract: A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.
    Type: Application
    Filed: August 27, 2004
    Publication date: September 8, 2005
    Inventors: J.B. Price, Jed Keller, Laurence Dulmage, David Cheng