Abstract: A method for making a semiconductor device includes creating conductive structures on a substrate. Contact pads of a semiconductor die are connected to first ends of conductive structures. The semiconductor die is encapsulated or embedded and the substrate is removed such that second ends of the conductive structures are exposed to the exterior.

Abstract: A stack of semiconductor chips includes a substrate or an interposer board comprising conductor structures for electrical connection of the stack and a first chip. The first chip includes an active side with peripherally arranged bonding pads and is mounted face-up on the substrate or the interposer board. The stack beyond includes at least a further chip with peripherally arranged bonding pads on its active side. The back side and at least two chip edges of the further chip are embedded by a mold cap providing a protuberance on the back side of the chip. The protuberance forms a planar surface extending substantially parallel and with a distance to the back side of the chip. The further chip is attached face-up to the active side of the first chip by an adhesive applied between the protuberance and the first chip so that the protuberance is inserted between both chips to provide a gap there. The protuberance has at least one linear dimension that is smaller than a linear dimension of the subjacent chip.

Abstract: A method for making a semiconductor device includes creating conductive structures on a substrate. Contact pads of a semiconductor die are connected to first ends of conductive structures. The semiconductor die is encapsulated or embedded and the substrate is removed such that second ends of the conductive structures are exposed to the exterior.

Abstract: Die arrangement, having a die with a plurality of electronic circuits electrically coupled to one another, at least one first electrical connection region, having at least one electrical connection, and a first passivation layer, which is applied whilst leaving free at least the one first electrical connection region. A second passivation layer, preferably a molding material, is arranged at least partly on the first passivation layer. At least one electrically conductive structure with a connecting element and a redistribution layer electrically connects the first electrical connection to a second electrical connection, which is formed by or at a section of the redistribution layer. The connecting element extends from the first electrical connection region through the first passivation layer and the second passivation layer, the redistribution layer coupled to the connecting section being arranged at least partly on the second passivation layer.