Abstract: A multilayer overlay interconnect for packaging various circuit elements such as integrated-circuit (IC) chips in high-density configurations. The overlay interconnect allows multiple IC chips to be removably mounted and electrically interconnected within a chip package with minimized interconnection lengths between the IC chips, for improved high speed operation of the chips. In addition, the back side of the chips remain accessible for making direct contact with a heat sink and/or a substrate interconnect which provides for good heat dissipation and/or additional electrical contact areas. The multilayer overlay interconnect is either flexible or both flexible and compressible.