Abstract: An imaging module for data collection devices, such as bar code scanners. The module includes an aiming or illumination light source or sources, seated on a support is mounted in a housing. The support is fixed in the housing to provide for its precise placement therein, in a predetermined position.

Abstract: A transceiver module includes a housing assembly, a single optical cable receptacle, an electronics subassembly in the housing assembly having a generally planar substrate, and an optics subsystem. The optics subsystem redirects an optical beam between the surface of the substrate and an optical axis of the receptacle. The structure of the housing assembly promotes airflow through the transceiver module. The transceiver module can be plugged into a chassis or cage of an electronic system. A latching mechanism can be included to secure the transceiver module in the cage. A tab can be included to facilitate un-latching and removal of the transceiver module from the cage.

Abstract: Systems and methods for direct cooling of transceivers, including transceivers used in electrical and optical communications systems. An electrical system includes a transceiver module with a housing that contains a plurality of apertures to allow air flow into and out of the transceiver module. The transceiver includes an internal heat sink located within the housing of the transceiver module, where the internal heat sink is thermally coupled to at least one internal component of the transceiver module. The electrical system also includes a cage for receiving and electrically connecting to the transceiver module.

Abstract: Systems and methods for direct cooling of transceivers, including transceivers used in electrical and optical communications systems. An electrical system includes a transceiver module with a housing that contains a plurality of apertures to allow air flow into and out of the transceiver module. The transceiver includes an internal heat sink located within the housing of the transceiver module, where the internal heat sink is thermally coupled to at least one internal component of the transceiver module. The electrical system also includes a cage for receiving and electrically connecting to the transceiver module.

Abstract: A connector having a Ball-Grid Array on one side of a connector circuit board and a socket recess on the other side of the connector circuit board can be used to mate an opto-electronic transceiver module to a system circuit board. A base portion of the transceiver module can be received in the socket recess. Within the socket recess, an exposed portion of the connector circuit board has an array of resilient conductive contacts corresponding to an array of conductive pads on the lower surface of the base portion of the transceiver module.

Abstract: A transceiver module includes a housing assembly, a single optical cable receptacle, an electronics subassembly in the housing assembly having a generally planar substrate, and an optics subsystem. The optics subsystem redirects an optical beam between the surface of the substrate and an optical axis of the receptacle. The structure of the housing assembly promotes airflow through the transceiver module. The transceiver module can be plugged into a chassis or cage of an electronic system. A latching mechanism can be included to secure the transceiver module in the cage. A tab can be included to facilitate un-latching and removal of the transceiver module from the cage.

Abstract: A connector having a Ball-Grid Array on one side of a connector circuit board and a socket recess on the other side of the connector circuit board can be used to mate an opto-electronic transceiver module to a system circuit board. A base portion of the transceiver module can be received in the socket recess. Within the socket recess, an exposed portion of the connector circuit board has an array of resilient conductive contacts corresponding to an array of conductive pads on the lower surface of the base portion of the transceiver module.

Abstract: A method for making semiconductor chips having coated portions can include mounting the chips in lead frames, stacking the lead frames in an orientation in which a portion of one lead frame masks a portion of a chip mounted on another lead frame but leaves another portion of the chip mounted on the other lead frame exposed to receive a coating, and depositing a coating on the stacked lead frames using, for example, an evaporative coating machine. In this manner, the coating is deposited on exposed portions of chips, such as its edges, and is not deposited on masked portions of chips, such as bond pads.

Abstract: A method for making semiconductor chips having coated portions can include mounting the chips in lead frames, stacking the lead frames in an orientation in which a portion of one lead frame masks a portion of a chip mounted on another lead frame but leaves another portion of the chip mounted on the other lead frame exposed to receive a coating, and depositing a coating on the stacked lead frames using, for example, an evaporative coating machine. In this manner, the coating is deposited on exposed portions of chips, such as its edges, and is not deposited on masked portions of chips, such as bond pads.

Abstract: The connector modules that are designed and shaped to mate with one side of the receptacle of the panel have mating devices that enable them to be stacked one atop the other inside of the receptacle in a relatively rigid stack. The connector modules that are designed and shaped to mate with the other side of the receptacle of the panel have mating devices that enable them to be held in slots that are slightly separated from one another by air gaps to allow them to “float” in the receptacle. By floating the connector modules in one side of the receptacle while having a relative rigid stack of connector modules in the other side of the receptacle, it is ensured that very precise optical alignment will be maintained between the respective lenses in the connector modules that face each other in the receptacle.

Abstract: A multi-fiber connector module for optical communications is provided that receives collimated beams of light from a transceiver module and focuses the collimated beams to respective focal points that coincide with the ends of respective transmit fibers. Because the inputs to the connector module are collimated light beams, movements of one or more parts of the connector and/or transceiver module will not result in optical losses as long as the movements are not so great as to prevent the collimated light beams from falling fully on the lenses of the optics system of the connector module. The lenses then focus the collimated light beams onto the ends of the transmit fibers.

Abstract: A method for making semiconductor chips having coated portions can include mounting the chips in lead frames, stacking the lead frames in an orientation in which a portion of one lead frame masks a portion of a chip mounted on another lead frame but leaves another portion of the chip mounted on the other lead frame exposed to receive a coating, and depositing a coating on the stacked lead frames using, for example, an evaporative coating machine. In this manner, the coating is deposited on exposed portions of chips, such as its edges, and is not deposited on masked portions of chips, such as bond pads.

Abstract: An imaging module for data collection devices, such as bar code scanners. The module includes an aiming or illumination light source or sources, seated on a support is mounted in a housing. The support is fixed in the housing to provide for its precise placement therein, in a predetermined position.

Abstract: A multi-fiber connector module for optical communications is provided that receives collimated beams of light from a transceiver module and focuses the collimated beams to respective focal points that coincide with the ends of respective transmit fibers. Because the inputs to the connector module are collimated light beams, movements of one or more parts of the connector and/or transceiver module will not result in optical losses as long as the movements are not so great as to prevent the collimated light beams from falling fully on the lenses of the optics system of the connector module. The lenses then focus the collimated light beams onto the ends of the transmit fibers.

Abstract: The connector modules that are designed and shaped to mate with one side of the receptacle of the panel have mating devices that enable them to be stacked one atop the other inside of the receptacle in a relatively rigid stack. The connector modules that are designed and shaped to mate with the other side of the receptacle of the panel have mating devices that enable them to be held in slots that are slightly separated from one another by air gaps to allow them to “float” in the receptacle. By floating the connector modules in one side of the receptacle while having a relative rigid stack of connector modules in the other side of the receptacle, it is ensured that very precise optical alignment will be maintained between the respective lenses in the connector modules that face each other in the receptacle.

Abstract: The connector modules that are designed and shaped to mate with one side of the receptacle of the panel have mating devices that enable them to be stacked one atop the other inside of the receptacle in a relatively rigid stack. The connector modules that are designed and shaped to mate with the other side of the receptacle of the panel have mating devices that enable them to be held in slots that are slightly separated from one another by air gaps to allow them to “float” in the receptacle. By floating the connector modules in one side of the receptacle while having a relative rigid stack of connector modules in the other side of the receptacle, it is ensured that very precise optical alignment will be maintained between the respective lenses in the connector modules that face each other in the receptacle.

Abstract: A transceiver module for optical communications is provided in which the leadframe assembly includes at least first and second die attach regions to which the laser diode driver IC and the laser diode IC are secured, respectively. A slot formed in the leadframe between the first and second die attach regions provides an air gap that at least partially thermally isolates the laser diode IC from the laser diode driver IC. This air gap results prevents heat generated by the laser diode driver IC from appreciably affecting the temperature of the laser diode IC, and thus from detrimentally affecting the performance of the laser diode IC. This slot also allows contact pads of the laser diode IC to be directly connected by leads to contact pads of the laser diode driver IC, which reduces the lengths of the leads and thus their inductances, which prevents EMI problems from occurring.

Abstract: A laser package includes a submount, a laser die mounted on the submount, a lid mounted on the submount over the laser die, and a soft metal disposed between the laser die and the lid, wherein the soft metal conducts heat between the laser die and the lid. The soft metal is able to creep or cold flow under pressure to accommodate for varying manufacturing tolerances and varying thermal expansion rates of the elements in the laser package.

Abstract: A connection cable includes an optical cable and an integrated electrical connector. The integrated electrical connector is permanently fixed to the optical cable. The integrated electrical connector is for plug-in connection to a matching electrical connector on a target device.

Abstract: A multi-fiber connector module for optical communications is provided that receives collimated beams of light from a transceiver module and focuses the collimated beams to respective focal points that coincide with the ends of respective transmit fibers. Because the inputs to the connector module are collimated light beams, movements of one or more parts of the connector and/or transceiver module will not result in optical losses as long as the movements are not so great as to prevent the collimated light beams from falling fully on the lenses of the optics system of the connector module. The lenses then focus the collimated light beams onto the ends of the transmit fibers.