Abstract: A motor casing and a combination of a motor casing and a plug connection, the motor casing being designed for a drive of movable components of a vehicle, in particular sunroofs, blinds or roofs of convertible. A plug is inserted in the motor casing and a gap is provided between the motor casing and the plug connection. According to the disclosure, at least one projection is provided in the area of the gap and avoids play between the motor casing and the plug connection.

Abstract: A motor casing and a combination of a motor casing and a plug connection, the motor casing being designed for a drive of movable components of a vehicle, in particular sunroofs, blinds or roofs of convertible. A plug is inserted in the motor casing and a gap is provided between the motor casing and the plug connection. According to the disclosure, at least one projection is provided in the area of the gap and avoids play between the motor casing and the plug connection.

Abstract: A differential pressure sensor with wireless RFID communication ability senses and records a specified differential pressure threshold without great energy consumption and without requiring direct access or visual inspection of the sensing element. The differential pressure sensor includes a sensing element sensing a differential pressure between a low pressure side and a high pressure side and a RFID tag comprising a tag antenna, a tag integrated circuit (IC) and a tamper loop connected to the tag IC for tracking a specific differential pressure threshold of the differential pressure sensor. The RFID tag is connected to the sensing element in such a way that the tamper loop is triggered if the specific differential pressure threshold has been reached.

Abstract: A differential pressure sensor with wireless RFID communication ability senses and records a specified differential pressure threshold without great energy consumption and without requiring direct access or visual inspection of the sensing element. The differential pressure sensor includes a sensing element sensing a differential pressure between a low pressure side and a high pressure side and a RFID tag comprising a tag antenna, a tag integrated circuit (IC) and a tamper loop connected to the tag IC for tracking a specific differential pressure threshold of the differential pressure sensor. The RFID tag is connected to the sensing element in such a way that the tamper loop is triggered if the specific differential pressure threshold has been reached.

Abstract: This invention relates generally to ID frequency identification (RFID) transponders and receivers. More specifically to the methods, apparatus and systems of the fabrication of the transponders and receivers. In one example embodiment, to methods, apparatus, and systems to form effective barriers for devices having a layer structure, including encapsulating at least a portion of the side of the devices from being degraded due to impurity penetration into a laminate structure of the devices, which can cause corrosion or malfunction of the devices.

Abstract: A motor casing and a combination of a motor casing and a plug connection, the motor casing being designed for a drive of movable components of a vehicle, in particular sunroofs, blinds or roofs of convertible. A plug is inserted in the motor casing and a gap is provided between the motor casing and the plug connection. According to the disclosure, at least one projection is provided in the area of the gap and avoids play between the motor casing and the plug connection.

Abstract: The invention relates to a method for producing chips (13) by dividing a wafer along dividing lines (11, 12) defining dimensions of the chip, wherein a focus (18) of a preferably pulsed laser radiation (16) is moved along the dividing lines on a first and at least a second path (25, 26) within the wafer body, wherein the laser radiation is applied to the wafer from a rear side (17) of the wafer, and the power density for producing the defects (28) on the first path (25) is lower than the power density for producing the defects (29) on the second path (26), and/or the number of defects on the first path is smaller than the number of defects on the second path.

Abstract: The invention relates to a method for producing chips (13) by dividing a wafer along dividing lines (11, 12) defining dimensions of the chip, wherein a focus (18) of a preferably pulsed laser radiation (16) is moved along the dividing lines on a first and at least a second path (25, 26) within the wafer body, wherein the laser radiation is applied to the wafer from a rear side (17) of the wafer, and the power density for producing the defects (28) on the first path (25) is lower than the power density for producing the defects (29) on the second path (26), and/or the number of defects on the first path is smaller than the number of defects on the second path.

Abstract: This invention relates generally to ID frequency identification (RFID) transponders and receivers. More specifically to the methods, apparatus and systems of the fabrication of the transponders and receivers. In one example embodiment, to methods, apparatus, and systems to form effective barriers for devices having a layer structure, including encapsulating at least a portion of the side of the devices from being degraded due to impurity penetration into a laminate structure of the devices, which can cause corrosion or malfunction of the devices.

Abstract: The invention relates to a method for producing chips (13) by dividing a wafer along dividing lines (11, 12) defining dimensions of the chip, wherein a focus (18) of a preferably pulsed laser radiation (16) is moved along the dividing lines on a first and at least a second path (25, 26) within the wafer body, wherein the laser radiation is applied to the wafer from a rear side (17) of the wafer, and the power density for producing the defects (28) on the first path (25) is lower than the power density for producing the defects (29) on the second path (26), and/or the number of defects on the first path is smaller than the number of defects on the second path.

Abstract: A method for fabricating a module having an electrical contact-connection is disclosed. One embodiment provides a chip having a contact area, applying a contact elevation to the contact area and applying a solder material to the contact elevation. The contact elevation may be applied to the contact area by using a bonding process in order to implement the contact elevation in the form of a stud bump.

Abstract: A stack of semiconductor chips includes a substrate or an interposer board comprising conductor structures for electrical connection of the stack and a first chip. The first chip includes an active side with peripherally arranged bonding pads and is mounted face-up on the substrate or the interposer board. The stack beyond includes at least a further chip with peripherally arranged bonding pads on its active side. The back side and at least two chip edges of the further chip are embedded by a mold cap providing a protuberance on the back side of the chip. The protuberance forms a planar surface extending substantially parallel and with a distance to the back side of the chip. The further chip is attached face-up to the active side of the first chip by an adhesive applied between the protuberance and the first chip so that the protuberance is inserted between both chips to provide a gap there. The protuberance has at least one linear dimension that is smaller than a linear dimension of the subjacent chip.

Abstract: The present invention relates to a method for fabricating a device module having the steps of providing an integrated device in a Ball Grid Array package wherein the integrated device has a solder contact elevated from a surface of the integrated device, providing a printed circuit board having a contact pad, applying a conductive adhesive on at least one of the solder ball contact and the contact pad, arranging the integrated device on the printed circuit board such that the solder ball contact structure is connected to the contact pad by means of the conductive adhesive.