Abstract: The present invention refers to a method for polishing polyamide objects obtained by additive manufacturing or 3D printing techniques, which comprises immersion of the polyamide object in a mixture of formic acid and dichloromethane at room temperature for a period of time comprised between 5 seconds and 6 minutes. This method allows effectively elimination or reduction of the roughness of the polyamide objects obtained by additive manufacturing or 3D printing techniques, for example, obtained by techniques such as the Selective Laser Sintering (SLS) with a simple procedure which does not require neither high temperatures nor extended treatment times. The present invention also refers to the object obtainable according to such method.

Abstract: In one embodiment, an apparatus for cooling an electrical component in a vehicle is provided. The apparatus comprises a power module including the electrical component for converting energy. The power module includes a first printed circuit board (PCB) including a first ceramic substrate for receiving the electrical component. The power module further includes a plurality of thermoelectric cells being coupled to the first PCB for discharging heat away from the electrical component. The power module further includes a second PCB including a second ceramic substrate being coupled to the plurality of thermoelectric cells, the first ceramic substrate and the second ceramic substrate for electrically isolating the electrical component from the first PCB and the second PCB and for providing thermal conductance from the electrical component through the plurality of thermoelectric cells.

Abstract: In one embodiment, an apparatus for cooling an electrical component in a vehicle is provided. The apparatus comprises a power module including the electrical component for converting energy. The power module includes a first printed circuit board (PCB) including a first ceramic substrate for receiving the electrical component. The power module further includes a plurality of thermoelectric cells being coupled to the first PCB for discharging heat away from the electrical component. The power module further includes a second PCB including a second ceramic substrate being coupled to the plurality of thermoelectric cells, the first ceramic substrate and the second ceramic substrate for electrically isolating the electrical component from the first PCB and the second PCB and for providing thermal conductance from the electrical component through the plurality of thermoelectric cells.