Abstract: A method of temporary bonding of an object having first and second opposite surfaces successively including bonding the object to a handle on the side of the first surface, bonding the object to a first adhesive film on the side of the second surface, bonding the first adhesive film to a second adhesive film on the side opposite to the object, and removing the handle from the object.

Abstract: A method of temporary bonding of an object having first and second opposite surfaces successively including bonding the object to a handle on the side of the first surface, bonding the object to a first adhesive film on the side of the second surface, bonding the first adhesive film to a second adhesive film on the side opposite to the object, and removing the handle from the object.

Abstract: This process includes steps: a) providing a carrier substrate including a receiving face; b) depositing a nonstick coating on the receiving face, the nonstick coating including a central region and a peripheral region; and c) trimming the carrier substrate so as to remove the peripheral region of the nonstick coating and to form a recess on the periphery of the carrier substrate, in order to obtain the handle wafer. Also relates to a process for temporarily bonding a substrate to a handle wafer fabricated using the process described above. Furthermore relates to a handle wafer fabricated using the process described above.

Abstract: This process includes steps: a) providing a carrier substrate including a receiving face; b) depositing a nonstick coating on the receiving face, the nonstick coating including a central region and a peripheral region; and c) trimming the carrier substrate so as to remove the peripheral region of the nonstick coating and to form a recess on the periphery of the carrier substrate, in order to obtain the handle wafer. Also relates to a process for temporarily bonding a substrate to a handle wafer fabricated using the process described above. Furthermore relates to a handle wafer fabricated using the process described above.

Abstract: A system is provided for individually supporting at least one component having opposing front and back faces, including a supporting device having a plurality of cells each delimited by a wall and having a contact zone to support the component, at least a part of the cells each receiving a component by its front face, the supporting and contact zones are configured so a surface of the front face is not in contact with the wall, the contact zone is located on a periphery of the front face and forms a closed zone around the front face, the supporting zone forms a closed zone on the wall, and the contact zone includes an edge surface set back in a thickness direction with respect to the front face, the thickness direction extending from the front to the back face perpendicular to at least one of the faces.

Abstract: A method for producing a holder of at least one substrate from a first and a second plate, each including first and second parallel flat faces, the method including: a) delimitation on the first face of the second plate of plural surfaces by a non-bondable area in which a direct bonding with a face of the first plate is prevented; b) bringing the first face of the second plate into contact with the first face of the first plate; c) direct bonding between the first faces except in the non-bondable area; and d) removal of the portions of the second plate located vertically below surfaces inside the non-bondable area.

Abstract: A method for making a support of at least one substrate, including: making a stack including at least two substrates, each of the two substrates including two opposite main faces, both substrates being secured to each other such that one of the main faces of a first of the two substrates is positioned facing one of the main faces of the second of the two substrates and against an etch-stop material; etching, through the first of the two substrates and with stop on the etch-stop material, at least one location that can receive a substrate that can be supported by the support.

Abstract: The invention relates to a system for individually supporting components (20), comprising at least one component (20) each comprising a front face (21) and a back face (22) opposite the front face (21), and a supporting device comprising a member (40) supporting said components (20), characterized in that the supporting member (40) is provided with cells (2) each one being delimited by a wall, with at least a part of the cells (41) each receiving a component (20) by the front face (21) thereof, with the cells (41) including a zone supporting a contact zone of the component (20), with the supporting zone and the contact zone being so configured that the surface of the front face (21) of the component (20) is not in contact with the wall of the cell (41).

Abstract: A method for producing a holder of at least one substrate from a first and a second plate, each including first and second parallel flat faces, the method including: a) delimitation on the first face of the second plate of plural surfaces by a non-bondable area in which a direct bonding with a face of the first plate is prevented; b) bringing the first face of the second plate into contact with the first face of the first plate; c) direct bonding between the first faces except in the non-bondable area; and d) removal of the portions of the second plate located vertically below surfaces inside the non-bondable area.

Abstract: A method for making a support of at least one substrate, including: making a stack including at least two substrates, each of the two substrates including two opposite main faces, both substrates being secured to each other such that one of the main faces of a first of the two substrates is positioned facing one of the main faces of the second of the two substrates and against an etch-stop material; etching, through the first of the two substrates and with stop on the etch-stop material, at least one location that can receive a substrate that can be supported by the support.