Abstract: A support for directing a fluid flow of a dielectric oil through a server includes an upper deck, a central channel, a cooling channel, a lip, and a channel orifice. The upper deck extends in a longitudinal plane and provides an abutment surface for a connection face of the server. The central channel is formed as a first opening of the upper deck that contains the server. The cooling channel is formed as a second opening of the upper deck, and houses a conduit and a radiator of a heat exchanger. The lip protrudes from the upper deck, and directs the fluid flow of the dielectric oil from the central channel into the cooling channel. Further, the channel orifice fluidly connects the cooling channel to the central channel, and the dielectric oil is transferred from the cooling channel into the central channel through the channel orifice.

Abstract: An uninterruptible cooling system includes a heat generating electronic component enshrouded by a first container, a heat exchanger enshrouded by a second container, and an Uninterruptible Cooling Supply (UCS). The uninterruptible cooling system further includes a heat exchange fluid and a fluid pump to circulate the heat exchange fluid through conduits fluidly connecting the first container, the second container, and the UCS. The UCS includes a radiator enshrouded by a casing and a heat transfer compound positioned in a space external to the radiator and internal to the casing. The heat transfer compound within the Uninterruptible Cooling Supply has a solid to liquid phase change threshold that is greater than the operating temperature of the heat exchange fluid downstream of the heat exchanger and less than the maximum temperature of the heat generating electronic component.

Abstract: An assembly for directing a fluid flow of a dielectric oil through a server includes shrouds and a manifold including ducts, a recess, cavities, and channels. Each shroud houses a radiator that is connected to a conduit of a heat exchange loop. The manifold is removably coupled to the shrouds. The ducts fluidly connect to the shrouds and are formed along an upper surface of the manifold. The recess receives a lower end of a server. The cavities are formed within the recess, and each cavity houses one or more micropumps that circulate the dielectric oil through the server. The channels fluidly connect the micropumps and the ducts such that the dielectric oil is transferred from the ducts to the micropumps through the channels.

Abstract: A spine interconnect device for a datacenter with liquid-cooled electronic components. The spine interconnect device includes a first bus bar and a second bus bar. The first and second bus bars each include one or more high power conductors. The spine interconnect device further includes a spine support configured to suspend the first bus bar and the second bus bar above the electronic components and a plurality of tap-off boxes each with a plurality of power ports. Each tap-off box is connected to and supported by the first bus bar or the second bus bar. The spine interconnect device further includes a plurality of power cables interconnecting the plurality of power ports to the electronic components, a low power tray with networking cables, and a networking switch. The spine interconnect device further includes a cold water conduit and a warm water return conduit and a manifold.

Abstract: A device for cooling an electronic component in a cooling fluid immersion environment includes a heatsink, a casing, a micropump, and a first conduit. The heatsink is removably attached to the electronic component and includes baffles that direct the cooling fluid to flow over the electronic component. The cooling fluid absorbs heat from the electronic component. The casing includes an inlet orifice, an outlet orifice, and an internal volume containing the heatsink and the electronic component. The micropump actuates to forcefully direct the cooling fluid from an area surrounding the device, through the inlet orifice, through the series of baffles of the heatsink, and out of the outlet orifice of the casing. Further, the first conduit is connected to the micropump and directs the cooling fluid to the series of baffles of the heatsink within the internal volume of the casing.

Abstract: A support for directing a fluid flow of a dielectric oil through a server includes an upper deck, a central channel, a cooling channel, a lip, and a channel orifice. The upper deck extends in a longitudinal plane and provides an abutment surface for a connection face of the server. The central channel is formed as a first opening of the upper deck that contains the server. The cooling channel is formed as a second opening of the upper deck, and houses a conduit and a radiator of a heat exchanger. The lip protrudes from the upper deck, and directs the fluid flow of the dielectric oil from the central channel into the cooling channel. Further, the channel orifice fluidly connects the cooling channel to the central channel, and the dielectric oil is transferred from the cooling channel into the central channel through the channel orifice.

Abstract: A system for cooling an electronic component includes a cylindrical container, a support, a heat exchanger, and one or more micropumps. The cylindrical container includes an internal volume that stores dielectric liquid. The internal volume is formed by an interior wall and a bottom of the cylindrical container. The support is positioned in the internal volume of the cylindrical container, and retains the electronic component within the dielectric liquid stored in the internal volume of the cylindrical container. The support also controls a flow of the dielectric liquid. The heat exchanger is positioned in the cylindrical container and circulates water from an external environment of the cylindrical container into and out of the internal volume of the cylindrical container. The one or more micropumps are integrally formed with and powered by the electronic component, and circulate the dielectric liquid through the electronic component.

Abstract: A system for immersion cooling electronic components includes a cylindrical container having a circular cross section, a cooling element disposed in the cylindrical container and containing a first cooling fluid, and a volume of a second cooling fluid disposed in the cylindrical container and in contact with the cooling element for exchange of heat between the second cooling fluid and the first cooling fluid, the second cooling fluid comprising an immersion cooling fluid. A heat generating electronic component is disposed within the cylindrical container and at least partially immersed in the second cooling fluid for exchange of heat between the electronic component and the second cooling fluid, and a fluid circulating device is disposed in the second cooling fluid to direct a flow of the second cooling fluid through the electronic component and over the cooling element.

Abstract: In a method of data filing, a data filing system receives a data element to be included in a data file. The data filing system randomly assigns an encryption key (703) to the data element so as to avoid that the encryption key (703) is assigned to another data element in the data filing system. The data filing system defines an expiry date (702) for the data element and internally stores the encryption key (703) in association with the expiry date (702) that has been defined. The data filing system encrypts the data element on the basis of the encryption key (703) so as to obtain an encrypted data element. The data filing system includes the encrypted data element in the data file. The data filing system deletes (705) the encryption key (703) when the expiry date (702) associated with the encryption key is reached. This technique allows respecting a right to be forgotten while ensuring integrity of an audit trial within the data filing system.

Abstract: A system for immersion cooling computing system equipment includes a container containing a volume of immersion cooling fluid. At least one heat generating computing system equipment component and a liquid-liquid heat exchanger are disposed in the volume of immersion cooling fluid. A manifold system is disposed between the heat generating computing system equipment component and the liquid-liquid heat exchanger to direct a flow of immersion cooling fluid between the heat generating computing system component and the liquid-liquid heat exchanger and to isolate the flow of immersion cooling fluid from a bulk amount of immersion cooling fluid. The flow of immersion cooling fluid and the bulk amount of immersion cooling fluid constitutes the volume of immersion cooling fluid.

Abstract: A system for immersion cooling computing system equipment includes a container containing a volume of immersion cooling fluid. At least one heat generating computing system equipment component and a liquid-liquid heat exchanger are disposed in the volume of immersion cooling fluid. A manifold system is disposed between the heat generating computing system equipment component and the liquid-liquid heat exchanger to direct a flow of immersion cooling fluid between the heat generating computing system component and the liquid-liquid heat exchanger and to isolate the flow of immersion cooling fluid from a bulk amount of immersion cooling fluid. The flow of immersion cooling fluid and the bulk amount of immersion cooling fluid constitutes the volume of immersion cooling fluid.