Abstract: A microelectronic assembly comprising a semiconductor structure (e.g., IC chip) and an interposer that is electrically connected to the semiconductor structure and contains a semiconductor material (e.g., silicon interposer) is provided. The assembly also comprises a decoupling capacitor that contains alternating dielectric layers and internal electrode layers, the internal electrode layers containing first internal electrode layers and second internal electrode layers. The capacitor further contains external terminals that are disposed on a first surface of the capacitor and electrically connected to the interposer and external terminals disposed on the second surface of the capacitor that are electrically connected to a circuit board.

Abstract: A microelectronic assembly comprising a first package comprising a first semiconductor structure electrically connected to a first package substrate and a second package electrically connected and disposed adjacent to the first package and that comprises a second semiconductor structure electrically connected to a second package substrate is provided. The assembly also comprises a decoupling capacitor that contains alternating dielectric layers and internal electrode layers, the internal electrode layers containing first internal electrode layers and second internal electrode layers. The capacitor further contains external terminals that are disposed on a first surface of the capacitor and electrically connected to the second package substrate and external terminals disposed on the second surface of the capacitor that are electrically connected to a circuit board.

Abstract: A microelectronic assembly comprising a semiconductor structure (e.g., IC chip) and an active interposer that is electrically connected to the semiconductor structure and contains an electronic component embedded within an insulating material. The assembly also comprises a decoupling capacitor that contains alternating dielectric layers and internal electrode layers, the internal electrode layers containing first internal electrode layers and second internal electrode layers. The capacitor further contains external terminals that are disposed on a first surface of the capacitor and electrically connected to the interposer and external terminals disposed on the second surface of the capacitor that are electrically connected to a circuit board.

Abstract: A microelectronic assembly comprising a semiconductor structure (e.g., IC chip), an interposer electrically connected to the semiconductor structure, and a package substrate electrically connected to the interposer is provided. The assembly also comprises a decoupling capacitor that contains alternating dielectric layers and internal electrode layers, the internal electrode layers containing first internal electrode layers and second internal electrode layers. The capacitor further contains external terminals that are disposed on a first surface of the capacitor and electrically connected to the package substrate and external terminals disposed on the second surface of the capacitor that are electrically connected to a circuit board.

Abstract: A semiconductor package assembly comprising a semiconductor structure (e.g., IC chip) and a package substrate electrically connected to the semiconductor structure is provided. The assembly also comprises a ceramic capacitor that contains alternating dielectric layers and internal electrode layers, the internal electrode layers containing first internal electrode layers and second internal electrode layers. The capacitor further contains external terminals that are disposed on a first surface of the capacitor and electrically connected to the semiconductor structure and external terminals disposed on the second surface of the capacitor that are electrically connected to the package substrate.

Abstract: A temperature sensor assembly can include a first temperature sensor that can be configured to obtain a first temperature measurement of a user. The temperature sensor assembly can further include a second temperature sensor that can be configured to obtain a second temperature measurement of the user. The temperature sensor assembly can further include one or more processors that can be configured to determine a third temperature measurement indicative of a temperature of the user based at least in part on the first temperature measurement and the second temperature measurement. The temperature sensor assembly can further include a base station communication antenna system that can include a modal antenna that can be configured to communicate the third temperature measurement with a base station based at least in part on a beam steering operation.

Abstract: A communication system is described where multiple communication networks are simultaneously accessible from a plurality of fixed and/or mobile communication devices. A Master and Slave hierarchy is implemented among the communication devices to improve communication properties on one or multiple networks. A network system controller is implemented to select the network with optimal communication characteristics for subsets of communication devices as well as assigning Master status to a communication device within these subsets.

Abstract: The disclosure concerns an antenna subsystem that can be used in various repeater systems to optimize gain of the repeater by increasing isolation between donor and server antennas, wherein at least one of the donor and server antennas is an active multi-mode antenna.

Abstract: The disclosure concerns an antenna subsystem that can be used in various repeater systems to optimize gain of the repeater by increasing isolation between donor and server antennas, wherein at least one of the donor and server antennas is an active multi-mode antenna.

Abstract: A communication system is described where multiple communication networks are simultaneously accessible from a plurality of fixed and/or mobile communication devices. A Master and Slave hierarchy is implemented among the communication devices to improve communication properties on one or multiple networks. A network system controller is implemented to select the network with optimal communication characteristics for subsets of communication devices as well as assigning Master status to a communication device within these subsets.

Abstract: A device includes a plurality of antennas, including one or more active antennas, the antennas being configured in one of a plurality of possible configurations to achieve operation in WAN, LTE, WiFi, or WiMax bands, or a combination thereof. In some embodiments, a passive antenna is utilized with lumped loading to fix the antenna tuning state. A primary and auxiliary radiator can be included in the device and configured for WAN/LTE bands, while additional antennas can be incorporated for WiFi and WiMax bands. Various antenna configurations incorporate the antenna having multiple coupled regions.

Abstract: The disclosure concerns an antenna subsystem that can be used in various repeater systems to optimize gain of the repeater by increasing isolation between donor and server antennas, wherein at least one of the donor and server antennas is an active multi-mode antenna.

Abstract: A method for obtaining the direction of a signal incoming to a communication device is provided using a modal antenna that has multiple modes corresponding to multiple radiation patterns with a single feed.

Abstract: The disclosure concerns a communication system where adaptive antenna systems with algorithm are used to provide improved channel selection management in Wireless Local Area Network (WLAN) and other multi-node communication systems. The adaptive antenna systems can be integrated into multiple nodes of a communication network, such as access points used in WLAN, and multiple radiation modes generated and tracked to determine optimal mode for access point to client communication links to assist in channel selection across the nodes in the network. Adaptive antenna system modes are selected and Signal to Noise Ratio (SNR) is measured across available frequency channels to determine channels to assign per access point along with radiation modes to be implemented that results in improved SNR for the communication links established in the network.

Abstract: An antenna system can include an antenna array having a plurality of antenna elements. The antenna system can include an array controller configured to control operation of the antenna array for beam forming of the antenna array. The antenna system can include a radiofrequency circuit. The antenna system can include a transmission line coupling the radiofrequency circuit to the array controller. The transmission line can be configured to carry a radio-frequency signal to the antenna array. The radiofrequency circuit can be configured to modulate an antenna array control signal onto the radiofrequency signal to generate a transmit signal for communication over the transmission line to the array controller. The array controller can be configured to demodulate the antenna array control signal from the transmit signal such that the array controller is configured to control operation of the antenna array based at least in part on the antenna array control signal.

Abstract: Methods directed to finding algorithms designed to estimate the angle of arrival of signals incoming to a communication device by using a modal antenna having multiple radiation patterns are provided. In particular, a method can include obtaining a gain variation between adjacent modes of a plurality of antenna modes at each of a plurality of angles. The method can include obtaining a signal strength variation between the adjacent modes at each of the plurality of angles. The method can include determining a difference value based, at least in part, on the gain variation and the signal strength variation. The method can include determining an angle of arrival of the signal based, at least in part, on the difference value.

Abstract: A load balancing method for cellular communication systems and communication systems in general is described where beam steering antenna systems on the client or user side of the communication link are used to optimize load balancing among the base stations or nodes. A system controller containing an algorithm is implemented to control the radiation modes from the client or user devices to assign the client or user devices to the various base stations or nodes and to dynamically vary the network load across the cellular or communication system.

Abstract: The disclosure concerns a signal aggregator component designed to couple with an antenna element to form an antenna system, wherein the resulting antenna system can achieve one-hundred percent or greater efficiency in receiving mode. In addition, the antenna system can achieve specific polarization and gain in different sectors of the antenna radiation pattern. The signal aggregator functions to dynamically enable or disable any number of its RF ports to select the RF input signal to aggregate.

Abstract: The disclosure concerns a communication system where adaptive antenna systems with algorithm are used to provide improved channel selection management in Wireless Local Area Network (WLAN) and other multi-node communication systems. The adaptive antenna systems can be integrated into multiple nodes of a communication network, such as access points used in WLAN, and multiple radiation modes generated and tracked to determine optimal mode for access point to client communication links to assist in channel selection across the nodes in the network. Adaptive antenna system modes are selected and Signal to Noise Ratio (SNR) is measured across available frequency channels to determine channels to assign per access point along with radiation modes to be implemented that results in improved SNR for the communication links established in the network.

Abstract: A technique is described where the switch and/or tunable control circuit for use with an active multi-mode antenna is positioned remote from the antenna structure itself for integration into host communication systems. Electrical delay and impedance characteristics are compensated for in the design and configuration of transmission lines or parasitic elements as the active multi-mode antenna structure is positioned in optimal locations such that significant electrical delay is introduced between the RF front-end circuit and multi-mode antenna. This technique can be implemented in designs where it is convenient to locate switches in a front-end module (FEM) and the FEM is located in vicinity to the transceiver.