Patents by Inventor Laurent Herschke

Laurent Herschke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11890809
    Abstract: A 3D printing kit can include a powder bed material comprising from about 80 wt % to 100 wt % polymer particles, a fusing agent to selectively apply to the powder bed material, and a hardener to selectively apply to the powder bed material. The polymeric particles can include a polyalkylene backbone with both ethylene and propylene polymerized monomeric units with from 2 mol % to 15 mol % of the polymerized monomeric units include a grafted side chain having an epoxide moiety. The fusing agent can include water and a radiation absorber that absorbs electromagnetic energy and converts the electromagnetic energy to heat. The hardener can be present in the fusing agent or can be included in a hardening agent that is separate from the fusing agent.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: February 6, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kyle Wycoff, Adekunle Olubummo, Maria del Carmen Querol Esparch, Laurent Herschke, Lihua Zhao
  • Publication number: 20240017483
    Abstract: A particulate build material for three-dimensional printing can include from about 80 wt % to 100 wt % polymer particles having an average particle size from about 10 ?m to about 125 ?m. The polymer particles can have a polyolefin polymer backbone with from about 90 mol % to 100 mol % polypropylene polymeric units and from 0 mol % to about 10 mol % polyethylene polymeric units. The polymer particles can further include a crosslinkable component in the form of a maleic anhydride-containing side chain appended to the polyolefin polymer backbone, a thiol-containing side chain appended to the polyolefin polymer backbone, a glycidyl polyhedral oligomeric silsesquioxane compounded with the polyolefin polymer backbone, or a combination thereof.
    Type: Application
    Filed: September 15, 2020
    Publication date: January 18, 2024
    Inventors: ADEKUNLE OLUBUMMO, LIHUA ZHAO, LAURENT HERSCHKE
  • Publication number: 20230321724
    Abstract: The present disclosure describes methods and systems for making three-dimensional printed objects. In one example, a method of making a three-dimensional printed object can include iteratively applying individual particulate build material layers to a powder bed. The particulate build material can include polymer particles that include a polyolefin and first nanoparticles compounded nanoparticles compounded with the polyolefin such that the first nanoparticles are embedded nanoparticles are embedded within the polymer particles. Second nanoparticles can be dry blended with the polymer particles. The first nanoparticles and second nanoparticles can include metal or metal oxide. The first and second nanoparticles can have a higher thermal conductivity that the polyolefin. A fusing agent including water and an electromagnetic radiation absorber can be selectively jetted onto the individual particulate build material layers.
    Type: Application
    Filed: June 17, 2021
    Publication date: October 12, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Laurent Herschke, Maria del Carmen Querol Esparch, Jerome Gimenez, Florian Deme
  • Patent number: 11745417
    Abstract: This disclosure describes compositions, kits, methods, systems, and three-dimensional parts. According to an example, described herein is a polymeric powder build material comprising a thermoplastic polymer powder composition, wherein the thermoplastic polymer powder composition comprises a polypropylene block copolymer made from a polymerizing propylene and ethylene or butylene or 1-pentene or 1-hexene or 1-octene or 4-methyl-1-pentene and polypropylene homopolymers.
    Type: Grant
    Filed: August 31, 2022
    Date of Patent: September 5, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Maria del Carmen Querol Esparch, Laurent Herschke
  • Patent number: 11613646
    Abstract: This disclosure describes compositions, kits, methods, systems, and three-dimensional parts. According to an example, described herein is a three-dimensional printed part made from three-dimensional printing, the three-dimensional part comprising: a thermoplastic polymer powder composition comprising a mixture of two or more polyolefins including at least 60 wt % of a C3 polyolefin based on the total weight of the mixture of the two or more polyolefins, wherein the thermoplastic polymer powder composition has a processing window of from about 120° C. to about 150° C.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: March 28, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Maria del Carmen Querol Esparch, Laurent Herschke
  • Patent number: 11613638
    Abstract: The present disclosure relates to a build material for 3D printing. The build material comprises polymeric particles comprising polypropylene and at least one elastomer. The polymeric particles comprise a surface-active coating.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: March 28, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Laurent Herschke, Maria del Carmen Querol Esparch
  • Publication number: 20230021140
    Abstract: This disclosure describes compositions, kits, methods, systems, and three-dimensional parts. According to an example, described herein is a polymeric powder build material comprising a thermoplastic polymer powder composition, wherein the thermoplastic polymer powder composition comprises a polypropylene block copolymer made from a polymerizing propylene and ethylene or butylene or 1-pentene or 1-hexene or 1-octene or 4-methyl-1-pentene and polypropylene homopolymers.
    Type: Application
    Filed: August 31, 2022
    Publication date: January 19, 2023
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Maria del Carmen Querol Esparch, Laurent Herschke
  • Patent number: 11548216
    Abstract: This disclosure describes compositions, kits, methods, systems, and three-dimensional parts. According to an example, described herein is a method of forming a polymeric powder build material composition for three-dimensional printing, the method comprising mixing a thermoplastic polymer powder composition, antioxidants, flow aids, a surface modifying agent, antistatic agents, and filler.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: January 10, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Maria del Carmen Querol Esparch, Laurent Herschke
  • Publication number: 20220127477
    Abstract: A 3D printing kit can include a powder bed material comprising from about 80 wt % to 100 wt % polymer particles, a fusing agent to selectively apply to the powder bed material, and a hardener to selectively apply to the powder bed material. The polymeric particles can include a polyalkylene backbone with both ethylene and propylene polymerized monomeric units with from 2 mol % to 15 mol % of the polymerized monomeric units include a grafted side chain having an epoxide moiety. The fusing agent can include water and a radiation absorber that absorbs electromagnetic energy and converts the electromagnetic energy to heat. The hardener can be present in the fusing agent or can be included in a hardening agent that is separate from the fusing agent.
    Type: Application
    Filed: July 17, 2019
    Publication date: April 28, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kyle Wycoff, Adekunle Olubummo, Maria del Carmen Querol Esparch, Laurent Herschke, Lihua Zhao
  • Publication number: 20210277222
    Abstract: This disclosure describes compositions, kits, methods, systems, and three-dimensional parts. According to an example, described herein is a three-dimensional printed part made from three-dimensional printing, the three-dimensional part comprising: a thermoplastic polymer powder composition comprising a mixture of two or more polyolefins including at least 60 wt % of a C3 polyolefin based on the total weight of the mixture of the two or more polyolefins, wherein the thermoplastic polymer powder composition has a processing window of from about 120° C. to about 150° C.
    Type: Application
    Filed: March 21, 2018
    Publication date: September 9, 2021
    Inventors: Maria del Carmen Querol Esparch, Laurent Herschke
  • Patent number: 11104819
    Abstract: This disclosure describes compositions, kits, methods, systems, and three-dimensional parts. According to an example, described herein is a threedimensional printing composition comprising: a polymeric powder build material comprising a thermoplastic polymer powder composition, wherein the thermoplastic polymer powder composition comprises: (a) at least 50 wt % of a C3 polyolefin, or a mixture of two or more polyolefins including at least 60 wt % of a C3 polyolefin based on the total weight of the mixture of the two or more polyolefins, (b) 0.1 to 1 wt % antioxidants, (c) 0.1 to 5 wt % flow aids, (d) 0-10 wt % of a surface modifying agent, (e) 0.05-wt %-10 wt % antistatic agents, (f) 2 wt % to 40 wt % filler, wherein the total of (a) to (f) is 100 wt %.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: August 31, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Maria del Carmen Querol Esparch, Laurent Herschke
  • Publication number: 20210139685
    Abstract: The present disclosure relates to a build material for 3D printing. The build material comprises polymeric particles comprising polypropylene and at least one elastomer. The polymeric particles comprise a surface-active coating.
    Type: Application
    Filed: May 17, 2018
    Publication date: May 13, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Laurent Herschke, Maria del Carmen Querol Esparch
  • Publication number: 20200406534
    Abstract: This disclosure describes compositions, kits, methods, systems, and three-dimensional parts. According to an example, described herein is a method of forming a polymeric powder build material composition for three-dimensional printing, the method comprising mixing a thermoplastic polymer powder composition, antioxidants, flow aids, a surface modifying agent, antistatic agents, and filler.
    Type: Application
    Filed: March 21, 2018
    Publication date: December 31, 2020
    Inventors: Maria del Carmen Querol Esparch, Laurent Herschke
  • Publication number: 20200115574
    Abstract: This disclosure describes compositions, kits, methods, systems, and three-dimensional parts. According to an example, described herein is a threedimensional printing composition comprising: a polymeric powder build material comprising a thermoplastic polymer powder composition, wherein the thermoplastic polymer powder composition comprises: (a) at least 50 wt % of a C3 polyolefin, or a mixture of two or more polyolefins including at least 60 wt % of a C3 polyolefin based on the total weight of the mixture of the two or more polyolefins, (b) 0.1 to 1 wt % antioxidants, (c) 0.1 to 5 wt % flow aids, (d) 0-10 wt % of a surface modifying agent, (e) 0.05-wt %-10 wt % antistatic agents, (f) 2 wt % to 40 wt % filler, wherein the total of (a) to (f) is 100 wt %.
    Type: Application
    Filed: March 21, 2018
    Publication date: April 16, 2020
    Inventors: Maria del Carmen Querol Esparch, Laurent Herschke
  • Publication number: 20180009982
    Abstract: Compounded copolyamide powders, processes for preparation of compounded copolyamide powders, articles made therefrom and uses.
    Type: Application
    Filed: July 11, 2016
    Publication date: January 11, 2018
    Inventors: Jonathan Martin STEELE, Said IBNO SALAH, Laurent HERSCHKE, Dirk HAENSCH, Remi Didier Robert GARDAN
  • Patent number: 8529694
    Abstract: A composition including particles of a carrier having on a surface thereof a compound according to structure (A) wherein either m is 1 and R is according to structure (B) in which n is an integer from 3 to 7, or m is 2 and R is according to structure C in which p is an integer from 1 to 10. Such compositions are useful for a variety of applications, for example the preparation of mortars and cements.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: September 10, 2013
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Laurent Herschke, Roger William Franciscus Reinartz
  • Publication number: 20080102274
    Abstract: A composition including particles of a carrier having on a surface thereof a compound according to structure (A) wherein either m is 1 and R is according to structure (B) in which n is an integer from 3 to 7, or m is 2 and R is according to structure C in which p is an integer from 1 to 10. Such compositions are useful for a variety of applications, for example the preparation of mortars and cements.
    Type: Application
    Filed: October 26, 2006
    Publication date: May 1, 2008
    Inventors: Laurent Herschke, Roger William Franciscus Reinartz