Abstract: A thermal mass flowmeter is provided to determine the air flow in a vent. The flowmeter includes a duct defined by printed circuit boards and adapted to insert in the vent. The flowmeter also includes a heating element located across the duct, for heating the air passing through the duct. At least one thermal sensor is located in the duct upstream from the heating element, relative to air flow, to measure inlet temperature of the air. At least one other thermal sensor is located in the duct downstream from the heating element, to measure outlet temperature heated by the heating element. The flowmeter further includes a support member to maintain the structural integrity of the duct within the vent, and at least one connector to exchange electrical signals with the flowmeter.

Abstract: There is described a spray chamber for cooling a computer processor on a circuit board. The spray chamber comprises: a wall assembly for sealable mounting on an exposed cooling surface of the computer processor defining an enclosure having a top opening and a bottom opening which opens on the top surface of the computer processor; and a lid for covering the top opening of the wall assembly in a sealable manner, the lid having a nozzle which sprays coolant that impinges on the exposed cooling surface of the computer processor.

Abstract: A device for cooling a processor which comprises a chamber which is bottomless and having a perimeter sealably mounted directly on a surface of a processor; a microgap plate, separate from the chamber, which is installed at a bottom of the chamber and forms a microgap with the surface of a processor; and a lid, separate from the chamber, which is installed onto the chamber to close a top of the chamber, the lid comprising downward projections to urge the microgap plate to the bottom of the chamber during installation. Walls forming the downward projections of the lid form a lining conforming to an inner surface of walls of the chamber, wherein the lid and the downward projections thereof together form a bottomless enclosure that defines an inlet plenum volume for receiving the coolant. The microgap comprises a central inlet through the microgap plate for coolant flow into the microgap.

Abstract: A device for cooling a processor which comprises a chamber which is bottomless and having a perimeter sealably mounted directly on a surface of a processor; a microgap plate, separate from the chamber, which is installed at a bottom of the chamber and forms a microgap with the surface of a processor; and a lid, separate from the chamber, which is installed onto the chamber to close a top of the chamber, the lid comprising downward projections to urge the microgap plate to the bottom of the chamber during installation. Walls forming the downward projections of the lid form a lining conforming to an inner surface of walls of the chamber, wherein the lid and the downward projections thereof together form a bottomless enclosure that defines an inlet plenum volume for receiving the coolant. The microgap comprises a central inlet through the microgap plate for coolant flow into the microgap.

Abstract: There is described a spray chamber for cooling a computer processor on a circuit board. The spray chamber comprises: a wall assembly for sealable mounting on an exposed cooling surface of the computer processor defining an enclosure having a top opening and a bottom opening which opens on the top surface of the computer processor; and a lid for covering the top opening of the wall assembly in a sealable manner, the lid having a nozzle which sprays coolant that impinges on the exposed cooling surface of the computer processor.