Abstract: Provided is a multilayer structure manufacturing method for bonding layers with adhesive film(s), comprising the steps of bonding one or more layers (4, 8, 5, 6) of its structure (1, 7) with thermosetting adhesive film(s) (2, 3), said thermosetting adhesive film(s) having recommended operating conditions of temperature and duration in its technical specification (TDS) to polymerize during thermal lamination (500, 600). The thermosetting adhesive is laminated with said layers in order to present a partial polymerization rate less than polymerization rate resulting from said recommended operating conditions.

Abstract: The embodiments of this invention relate to a smart card (1) comprising the following:—an integrated circuit chip (10),—a primary card body (3) with a first form factor, comprising a slot (5) on the front (7) designed to accommodate the integrated circuit chip (10), wherein the said primary card body (3) also comprises a detachable contour (c1), peripheral to the slot (5), which represents another form factor and defines a secondary card body (11), characterised in that the primary card body (3) has a first thickness (el), between the front (7) and a back (8), and in that the secondary card body (11) has a second thickness (e2), between a front (7, 12) and a back (14), which is smaller than the first thickness (el).

Abstract: The invention relates to a chip card comprising, a molded card body made by means of injection molding and, an integrated circuit chip, as well as to a method for manufacturing such a card. The invention is characterized in that the card body includes polyacrylic acid. The invention applies to SIM cards in particular.

Abstract: The invention relates to a chip card comprising, a molded card body made by means of injection molding and, an integrated circuit chip, as well as to a method for manufacturing such a card. The invention is characterized in that the card body includes polyacrylic acid. The invention applies to SIM cards in particular.

Abstract: The invention concerns a method for making smart cards capable of operating with or without contact called mixed cards and contactless smart cards. In order to avoid the risk of deteriorating the antenna the method consists in producing an antenna comprising at least two turns, on a support sheet, said antenna having its turns located outside the connecting pads, and in providing an insulating bridge so as to connect each of the antenna ends to a connection pad respectively.

Abstract: The invention concerns a method for making smart cards capable of operating with or without contact called mixed cards and contactless smart cards. In order to avoid the risk of deteriorating the antenna the method consists in producing an antenna comprising at least two turns, on a support sheet, said antenna having its turns located outside the connecting pads, and in providing an insulating bridge so as to connect each of the antenna ends to a connection pad respectively.

Abstract: The invention concerns a method for making smart cards capable of operating with or without contact called mixed cards and contactless smart cards. In order to avoid the risk of deteriorating the antenna the method consists in producing an antenna comprising at least two turns, on a support sheet, said antenna having its turns located outside the connecting pads, and in providing an insulating bridge so as to connect each of the antenna ends to a connection pad respectively.

Abstract: A smart card includes a card bearing a module that is made up of a support supporting at least an electronic chip. The support is fixed on one surface of the card. This surface extends up to at least one of the edges of the card.

Abstract: The invention concerns a method for making smart cards capable of operating with or without contact called mixed cards and contactless smart cards. In order to avoid the risk of deteriorating the antenna the method consists in producing an antenna comprising at least two turns, on a support sheet, said antenna having its turns located outside the connecting pads, and in providing an insulating bridge so as to connect each of the antenna ends to a connection pad respectively.

Abstract: A smart card includes a card bearing a module that is made up of a support supporting at least an electronic chip. The support is fixed on one surface of the card. This surface extends up to at least one of the edges of the card.

Abstract: A method for making a contactless chip card of the type having an electronic module, and an antenna connected to the module, includes the following steps: producing, on a first support sheet, the antenna with connection terminals provided at its ends; producing an insulating bridge partly covering the antenna coils except for the connection terminals; depositing a drop of filling material on the insulating bridge; transferring the electronic module, with its connection pads being oriented towards the insulating bridge; and providing an electric connection between the module contact pads and the antenna connection terminals.

Abstract: The disclosed invention relates to a method of manufacturing an electronic device having a chip and/or an antenna, such as a contactless or hybrid or label chip card. The electronic device includes at least one decorative sheet having a visible outer face, and at least one interface comprising an antenna. The method includes a step in which the antenna is formed on that face of the decorative sheet which is opposite its visible outer face by screen-printing using a conductive ink. The invention also relates to the resulting electronic device.

Abstract: A contactless smart card has a sheet-like body containing an integrated circuit and an antenna via which the integrated circuit communicates with a terminal. The antenna lies in the plane of the card body and is constituted by several turns of a conductor that form a winding. A conductive bridge connects at least two turns of the winding to reduce its inductance. The card body includes a rupture zone that is designed to be broken when the card is first used. A portion of the connecting bridge lies within the rupture zone, so that it is broken when the rupture zone is broken during use.