Abstract: The method of manufacturing a functional inlay, comprises at least the steps of: (1) providing a substrate with a wire antenna embedded therein and with an aperture wherein two wire antenna portions are positioned over said aperture; (2) acquiring the positions and the dimensions of said wire antenna portions and of said aperture; (3) determining if the acquired positions and dimensions meet predetermined tolerances; (4) if the acquired dimensions and positions meet said tolerances, then placing a chip in fie aperture so that said wire portions are positioned over connections pads of said chip and then bonding said wire portions to said connection pads.

Abstract: The method of manufacturing a functional inlay, comprises at least the steps of: (1) providing a substrate (7) with a wire antenna embedded therein and with an aperture (6) wherein two wire antenna portions (4,5) are positioned over said aperture (6); (2) acquiring the positions and the dimensions of said wire antenna portions (4,5) and of said aperture (6); (3) determining If the acquired positions and dimensions meet predetermined tolerances; (4) if the acquired dimensions and positions meet said tolerances, then placing a chip (1) in fie aperture (6) so that said wire portions (4,5) are positioned over connections pads (2,3) of said chip (1) and then bonding said wire portions (4,5) to said connection pads (2,3).

Abstract: The method of manufacturing a functional inlay comprises the steps of: a support layer with at least a first and a second side a wire antenna in said support layer processing said support layer with said embedded wire antenna to a connection station in which said support layer is approached on said first side by a holding device holding a chip with a surface comprising connection pads; said support layer is approached on said second side by a connection device; and said antenna wire is connected to said connection pads by means of a reciprocal pressure exerted between said holding device and said connection device.

Abstract: The method of manufacturing a functional inlay comprises the steps of: a support layer with at least a first and a second side a wire antenna in said support layer processing said support layer with said embedded wire antenna to a connection station in which said support layer is approached on said first side by a holding device holding a chip with a surface comprising connection pads; said support layer is approached on said second side by a connection device; and said antenna wire is connected to said connection pads by means of a reciprocal pressure exerted between said holding device and said connection device.

Abstract: The method of manufacturing a functional inlay comprises the steps of: —) providing a support layer with at least a first and a second side —) embedding a wire antenna in said support layer —) processing said support layer with said embedded wire antenna to a connection station in which —) said support layer is approached on said first side by a holding device holding a chip with a surface comprising connection pads; —) said support layer is approached on said second side by a connection device; and —) said antenna wire is connected to said connection pads by means of a reciprocal pressure exerted between said holding device and said connection device.

Abstract: The method of manufacturing a functional inlay comprises the steps of: —providing a support layer with at least a first and a second side —embedding a wire antenna in said support layer —processing said support layer with said embedded wire antenna to a connection station in which —said support layer is approached on said first side by a holding device holding a chip with a surface comprising connection pads; —said support layer is approached on said second side by a connection device; and —said antenna wire is connected to said connection pads by means of a reciprocal pressure exerted between said holding device and said connection device.