Patents by Inventor Laurie A. Coventry

Laurie A. Coventry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11214064
    Abstract: In some examples, a fluidic die includes a substrate, a fluidic region comprising fluid chambers formed in a fluidic barrier layer supported by the substrate, fluidic actuators associated with the fluid chambers, electrical structures positioned away from the fluidic region, a metallic layer over the fluidic actuators, and an adherent barrier layer to adhere the metallic layer to the fluidic barrier layer. The adherent barrier layer includes a first adherent barrier layer portion comprising a dielectric layer and an adhesion layer, and a second adherent barrier layer portion comprising the adhesion layer and without the dielectric layer, the first adherent barrier layer portion formed over the electrical structures, and the second adherent barrier layer portion formed in the fluidic region, the adhesion layer of the second adherent barrier layer portion protruding into the fluid chambers.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: January 4, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Laurie A. Coventry, David R. Thomas
  • Publication number: 20210331475
    Abstract: In some examples, a fluidic die includes a substrate, a fluidic region comprising fluid chambers formed in a fluidic barrier layer supported by the substrate, fluidic actuators associated with the fluid chambers, electrical structures positioned away from the fluidic region, a metallic layer over the fluidic actuators, and an adherent barrier layer to adhere the metallic layer to the fluidic barrier layer. The adherent barrier layer includes a first adherent barrier layer portion comprising a dielectric layer and an adhesion layer, and a second adherent barrier layer portion comprising the adhesion layer and without the dielectric layer, the first adherent barrier layer portion formed over the electrical structures, and the second adherent barrier layer portion formed in the fluidic region, the adhesion layer of the second adherent barrier layer portion protruding into the fluid chambers.
    Type: Application
    Filed: April 2, 2018
    Publication date: October 28, 2021
    Inventors: Laurie A. Coventry, David R. Thomas
  • Patent number: 10137687
    Abstract: Printing apparatus and methods of producing such a device are disclosed. An example printhead die includes a first resistor (404) to cause fluid to be ejected out of a first nozzle (142; 205; 305) and a second resistor (405) to cause fluid to be ejected out of a second nozzle (142, 205, 305). The example printhead die also includes a first cavitation plate (408) to cover the first resistor (404) and a second cavitation plate (412) to cover the second resistor (405), the first cavitation plate (408) spaced from the second cavitation plate (412).
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: November 27, 2018
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Laurie A Coventry, Rodney L Alley, David R Thomas
  • Publication number: 20170305168
    Abstract: Printing apparatus and methods of producing such a device are disclosed. An example printhead die includes a first resistor (404) to cause fluid to be ejected out of a first nozzle (142; 205; 305) and a second resistor (405) to cause fluid to be ejected out of a second nozzle (142, 205, 305). The example printhead die also includes a first cavitation plate (408) to cover the first resistor (404) and a second cavitation plate (412) to cover the second resistor (405), the first cavitation plate (408) spaced from the second cavitation plate (412).
    Type: Application
    Filed: October 30, 2014
    Publication date: October 26, 2017
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Laurie A Coventry, Rodney L Alley, David R Thomas
  • Patent number: 6464343
    Abstract: A fluid drop ejecting apparatus including a thin film stack including a plurality of heater resistors formed on a substrate having a feed edge, a patterned fluid barrier layer disposed on the thin film stack, respective fluid chambers formed in the barrier layer over respective heater resistors, fluid feed features formed in the barrier layer between the fluid feed edge and the ink chambers, and a thin film metal structure in a metal layer of the thin film stack and located between the ink feed edge and the fluid chambers.
    Type: Grant
    Filed: October 31, 2001
    Date of Patent: October 15, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Laurie A. Coventry, Allen H. Smith, Dustin W. Blair