Patents by Inventor Laurie A. Goldstein

Laurie A. Goldstein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6146541
    Abstract: A semiconductor wafer (11) having a dielectric layer (12) is used as a calibration standard (10) to calibrate thickness measuring equipment in a wafer processing or manufacturing area. The thickness of the dielectric layer (12) is maintained to a desired thickness by heating the calibration standard (10) to remove contaminants from the dielectric layer (12).
    Type: Grant
    Filed: May 2, 1997
    Date of Patent: November 14, 2000
    Assignee: Motorola, Inc.
    Inventors: Laurie A. Goldstein, Timothy J. Warfield, Jane K. Gates, Elizabeth Apen