Abstract: The present document describes an electronic device with a structural midframe and associated methods. The architectural design of the electronic device (e.g., a security camera) is such that its components are assembled onto the midframe to form a subassembly and the housing is assembled after the subassembly. The midframe includes various features that enable multiple printed circuit boards, a camera subassembly, a front housing member, a heatsink, and a heat spreader to be assembled onto the midframe outside of the housing. The midframe can also include a hinge-bearing surface forming a portion of a ball joint for supporting rotational movement of the electronic device. Accordingly, the electronic device uses the midframe, rather than the housing, as a structural member.

Abstract: The present document describes an electronic device with a structural midframe and associated methods. The architectural design of the electronic device (e.g., a security camera) is such that its components are assembled onto the midframe to form a subassembly and the housing is assembled after the subassembly. The midframe includes various features that enable multiple printed circuit boards, a camera subassembly, a front housing member, a heatsink, and a heat spreader to be assembled onto the midframe outside of the housing. The midframe can also include a hinge-bearing surface forming a portion of a ball joint for supporting rotational movement of the electronic device. Accordingly, the electronic device uses the midframe, rather than the housing, as a structural member.

Abstract: The present document describes an electronic device with a structural midframe and associated methods. The architectural design of the electronic device (e.g., a security camera) is such that its components are assembled onto the midframe to form a subassembly and the housing is assembled after the subassembly. The midframe includes various features that enable multiple printed circuit boards, a camera subassembly, a front housing member, a heatsink, and a heat spreader to be assembled onto the midframe outside of the housing. The midframe can also include a hinge-bearing surface forming a portion of a ball joint for supporting rotational movement of the electronic device. Accordingly, the electronic device uses the midframe, rather than the housing, as a structural member.

Abstract: This document describes a speaker-integration system and associated devices and systems. The speaker-integration system includes a speaker that is re-workably mounted, via an elastomeric gasket, to an intermediate structure that is mountable to an outer enclosure of an electronic device. The intermediate structure forms a cavity in which the speaker is sealed, effective to use the cavity as the speaker's back volume to contain acoustic waves without impacting other structures in the electronic device. The front of the speaker is sealed against the outer enclosure by a gasket that controls, based on its placement and geometry, axial and radial directions of the speaker relative to the intermediate structure to prevent the speaker from buzzing against surrounding rigid parts. The speaker has wires that exit the back volume via a detachable grommet, which controls positioning of the wires to prevent rub and buzz against surrounding parts.

Abstract: This document describes a speaker-integration system and associated devices and systems. The speaker-integration system includes a speaker that is re-workably mounted, via an elastomeric gasket, to an intermediate structure that is mountable to an outer enclosure of an electronic device. The intermediate structure forms a cavity in which the speaker is sealed, effective to use the cavity as the speaker's back volume to contain acoustic waves without impacting other structures in the electronic device. The front of the speaker is sealed against the outer enclosure by a gasket that controls, based on its placement and geometry, axial and radial directions of the speaker relative to the intermediate structure to prevent the speaker from buzzing against surrounding rigid parts. The speaker has wires that exit the back volume via a detachable grommet, which controls positioning of the wires to prevent rub and buzz against surrounding parts.

Abstract: The present document describes an electronic device with a structural midframe and associated methods. The architectural design of the electronic device (e.g., a security camera) is such that its components are assembled onto the midframe to form a subassembly and the housing is assembled after the subassembly. The midframe includes various features that enable multiple printed circuit boards, a camera subassembly, a front housing member, a heatsink, and a heat spreader to be assembled onto the midframe outside of the housing. The midframe can also include a hinge-bearing surface forming a portion of a ball joint for supporting rotational movement of the electronic device. Accordingly, the electronic device uses the midframe, rather than the housing, as a structural member.

Abstract: This document describes a speaker-integration system and associated devices and systems. The speaker-integration system includes a speaker that is re-workably mounted, via an elastomeric gasket, to an intermediate structure that is mountable to an outer enclosure of an electronic device. The intermediate structure forms a cavity in which the speaker is sealed, effective to use the cavity as the speaker's back volume to contain acoustic waves without impacting other structures in the electronic device. The front of the speaker is sealed against the outer enclosure by a gasket that controls, based on its placement and geometry, axial and radial directions of the speaker relative to the intermediate structure to prevent the speaker from buzzing against surrounding rigid parts. The speaker has wires that exit the back volume via a detachable grommet, which controls positioning of the wires to prevent rub and buzz against surrounding parts.