Patents by Inventor Lavinia NISTOR

Lavinia NISTOR has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11101117
    Abstract: Embodiments of a method and apparatus for co-sputtering multiple target materials are provided herein. In some embodiments, a process chamber including a substrate support to support a substrate; a plurality of cathodes coupled to a carrier and having a corresponding plurality of targets to be sputtered onto the substrate; and a process shield coupled to the carrier and extending between adjacent pairs of the plurality of targets.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: August 24, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Anantha K. Subramani, Hanbing Wu, Wei W. Wang, Ashish Goel, Srinivas Guggilla, Lavinia Nistor
  • Publication number: 20200013597
    Abstract: Embodiments of a method and apparatus for co-sputtering multiple target materials are provided herein. In some embodiments, a process chamber including a substrate support to support a substrate; a plurality of cathodes coupled to a carrier and having a corresponding plurality of targets to be sputtered onto the substrate; and a process shield coupled to the carrier and extending between adjacent pairs of the plurality of targets.
    Type: Application
    Filed: September 17, 2019
    Publication date: January 9, 2020
    Inventors: Anantha K. SUBRAMANI, Hanbing WU, Wei W. WANG, Ashish GOEL, Srinivas GUGGILLA, Lavinia NISTOR
  • Patent number: 10468238
    Abstract: Embodiments of a method and apparatus for co-sputtering multiple target materials are provided herein. In some embodiments, a process chamber including a substrate support to support a substrate; a plurality of cathodes coupled to a carrier and having a corresponding plurality of targets to be sputtered onto the substrate; and a process shield coupled to the carrier and extending between adjacent pairs of the plurality of targets.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: November 5, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Anantha K. Subramani, Hanbing Wu, Wei W. Wang, Ashish Goel, Srinivas Guggilla, Lavinia Nistor
  • Publication number: 20170053784
    Abstract: Embodiments of a method and apparatus for co-sputtering multiple target materials are provided herein. In some embodiments, a process chamber including a substrate support to support a substrate; a plurality of cathodes coupled to a carrier and having a corresponding plurality of targets to be sputtered onto the substrate; and a process shield coupled to the carrier and extending between adjacent pairs of the plurality of targets.
    Type: Application
    Filed: August 18, 2016
    Publication date: February 23, 2017
    Inventors: Anantha K. SUBRAMANI, Hanbing WU, Wei W. WANG, Ashish GOEL, Srinivas GUGGILLA, Lavinia NISTOR