Abstract: This invention provides novel nanofiber enhanced surface area substrates and structures comprising such substrates for use in various medical devices, as well as methods and uses for such substrates and medical devices. In one particular embodiment, methods for enhancing cellular functions on a surface of a medical device implant are disclosed which generally comprise providing a medical device implant comprising a plurality of nanofibers (e.g., nanowires) thereon and exposing the medical device implant to cells such as osteoblasts.

Abstract: This invention provides novel nanofiber enhanced surface area substrates and structures comprising such substrates for use in various medical devices, as well as methods and uses for such substrates and medical devices. In one particular embodiment, methods for enhancing cellular functions on a surface of a medical device implant are disclosed which generally comprise providing a medical device implant comprising a plurality of nanofibers (e.g., nanowires) thereon and exposing the medical device implant to cells such as osteoblasts.

Abstract: This invention provides novel nanofiber enhanced surface area substrates and structures comprising such substrates for use in various medical devices, as well as methods and uses for such substrates and medical devices. In one particular embodiment, methods for enhancing cellular functions on a surface of a medical device implant are disclosed which generally comprise providing a medical device implant comprising a plurality of nanofibers (e.g., nanowires) thereon and exposing the medical device implant to cells such as osteoblasts.

Abstract: A method and apparatus for an electronic substrate having a plurality of semiconductor devices is described. A thin film of nanowires is formed on a substrate. The thin film of nanowires is formed to have a sufficient density of nanowires to achieve an operational current level. A plurality of semiconductor regions are defined in the thin film of nanowires. Contacts are formed at the semiconductor device regions to thereby provide electrical connectivity to the plurality of semiconductor devices. Furthermore, various materials for fabricating nanowires, thin films including p-doped nanowires and n-doped nanowires, nanowire heterostructures, light emitting nanowire heterostructures, flow masks for positioning nanowires on substrates, nanowire spraying techniques for depositing nanowires, techniques for reducing or eliminating phonon scattering of electrons in nanowires, and techniques for reducing surface states in nanowires are described.

Abstract: A method and apparatus for an electronic substrate having a plurality of semiconductor devices is described. A thin film of nanowires is formed on a substrate. The thin film of nanowires is formed to have a sufficient density of nanowires to achieve an operational current level. A plurality of semiconductor regions are defined in the thin film of nanowires. Contacts are formed at the semiconductor device regions to thereby provide electrical connectivity to the plurality of semiconductor devices. Furthermore, various materials for fabricating nanowires, thin films including p-doped nanowires and n-doped nanowires, nanowire heterostructures, light emitting nanowire heterostructures, flow masks for positioning nanowires on substrates, nanowire spraying techniques for depositing nanowires, techniques for reducing or eliminating phonon scattering of electrons in nanowires, and techniques for reducing surface states in nanowires are described.

Abstract: A method and apparatus for an electronic substrate having a plurality of semiconductor devices is described. A thin film of nanowires is formed on a substrate. The thin film of nanowires is formed to have a sufficient density of nanowires to achieve an operational current level. A plurality of semiconductor regions are defined in the thin film of nanowires. Contacts are formed at the semiconductor device regions to thereby provide electrical connectivity to the plurality of semiconductor devices. Furthermore, various materials for fabricating nanowires, thin films including p-doped nanowires and n-doped nanowires, nanowire heterostructures, light emitting nanowire heterostructures, flow masks for positioning nanowires on substrates, nanowire spraying techniques for depositing nanowires, techniques for reducing or eliminating phonon scattering of electrons in nanowires, and techniques for reducing surface states in nanowires are described.

Abstract: A process is disclosed for reducing the concentration of a dialkyl ether in a mixture comprising the dialkyl ether and a dialkyl peroxide wherein the process comprises treating said mixture with a strong acid.

Abstract: A method and apparatus for an electronic substrate having a plurality of semiconductor devices is described. A thin film of nanowires is formed on a substrate. The thin film of nanowires is formed to have a sufficient density of nanowires to achieve an operational current level. A plurality of semiconductor regions are defined in the thin film of nanowires. Contacts are formed at the semiconductor device regions to thereby provide electrical connectivity to the plurality of semiconductor devices. Furthermore, various materials for fabricating nanowires, thin films including p-doped nanowires and n-doped nanowires, nanowire heterostructures, light emitting nanowire heterostructures, flow masks for positioning nanowires on substrates, nanowire spraying techniques for depositing nanowires, techniques for reducing or eliminating phonon scattering of electrons in nanowires, and techniques for reducing surface states in nanowires are described.

Abstract: An organic peroxide stabilizing composition comprises an organic peroxide and an organic peroxide stabilizing compound selected from one of the following general formulas (I) or (II): R1CH?CH(CH2)m(CH?CH)n(CH2)oR2??(I) R4C?C—C(O)OR5??(II) or mixture thereof wherein R1 is hydrogen, alkyl of from 1 to about 10 carbon atoms, or aryl of from 6 to about 12 carbon atoms, optionally substituted with at least one halogen, lower alkyl, or hydroxy group; R2 is hydrogen, —OH, —C(O)R3 or —C(O)OR3 in which R3 is hydrogen or lower alkyl; R4 and R5 each independently has one of the meanings of R1 and, additionally, R4 can be —C(O)OR3; wherein R3 has one of the same meanings as above and m is 0 or an integer of from 1 to about 20, n is 0 or 1 and o is 0 or an integer of from 1 to about 20 in an amount sufficient to retard the rate of decomposition of the organic peroxide.

Abstract: An organic peroxide stabilizing composition comprises an organic peroxide and an organic peroxide stabilizing compound selected from one of the following general formulas (I) or (II):

Abstract: A crosslinking system which includes a 1,2,4-trioxacycloheptane and a crosslink-promoting polyfunctional ethylenically unsaturated compound. This system is employed in a process of crosslinking a thermoplastic polymer. Preferred polymers, useful in this process, include ethylene homopolymers and copolymers.

Abstract: Disclosed are high concentration aqueous dispersions of normally solid organic peroxides using a dispersion agent comprising an alkylaryl polyether alcohol and an oxyalkylated phenolic resin. Optional components such as thickening agents, anionic emulsifiers and a partial ester of a carboxylic acid copolymer may also be included. Dispersions having concentrations of up to about 65% weight percent organic peroxide can be prepared. Dispersions having concentrations of up to about 40 weight percent organic peroxide are sprayable. Also disclosed are the curing of polyester resins and the suspension polymerization of vinyl monomers using these dispersions.

Abstract: A storage stable aqueous dispersion useful in the curing of unsaturated polyester resins and the suspension polymerization of vinyl monomers containing an aromatic diacyl peroxide, an alkylene glycol and dispersion-stabilizing amounts of magnesium aluminum silicate and a cellulose ether compound is disclosed. Also disclosed are the curing of polyester resins and the suspension polymerization of vinyl monomers using the dispersion.

Abstract: A storage stable aqueous dispersion useful in the curing of unsaturated polyester resins and the suspension polymerization of vinyl monomers containing an aromatic diacyl peroxide, an alkylene glycol and dispersion-stabilizing amounts of magnesium aluminum silicate and a cellulose ether compound is disclosed. Also disclosed are the curing of polyester resins and the suspension polymerization of vinyl monomers using the dispersion.

Abstract: A storage stable aqueous dispersion useful in the curing and foaming of unsaturated polyester resins comprising an aromatic diacyl peroxide, an alkali metal carbonate or bicarbonate, dispersion-stabilizing amount of magnesium aluminum silicate and an alkali metal carboxymethyl cellulose, glycerol and water. As an optional component this composition can also contain an anionic dispersing agent. Also disclosed is the preparation of foamed polyester resins using the dispersion.

Abstract: A storage stable aqueous dispersion useful in the curing and foaming of unsaturated polyester resins comprising an aromatic diacyl peroxide, an alkali metal carbonate or bicarbonate, dispersion-stabilizing amount of magnesium aluminum silicate and an alkali metal carboxymethyl cellulose, glycerol and water. As an optional component this composition can also contain an anionic dispersing agent. Also disclosed is the preparation of foamed polyester resins using the dispersion.

Abstract: A storage stable aqueous dispersion useful in the curing and foaming of unsaturated polyester resins containing an aromatic diacyl peroxide, an alkali metal carbonate or bicarbonate and dispersion-stabilizing amounts of magnesium aluminum silicate and an alkali metal carboxymethyl cellulose. Also disclosed is the preparation of foamed polyester resins using the dispersion.

Abstract: A storage stable aqueous dispersion useful in the curing and foaming of unsaturated polyester resins containing an aromatic diacyl peroxide, an alkali metal carbonate or bicarbonate and dispersion-stabilizing amounts of magnesium aluminum silicate and an alkali metal carboxymethyl cellulose. Also disclosed is the preparation of foamed polyester resins using the dispersion.

Abstract: Novel processes and compositions are provided for the preparation of foamed, cross-linked polyethylene utilizing di(alkylperoxy)acetylene cross-linking/blowing agents. The novel compositions include esters of thiodipropionic acid as activators.

Abstract: Gem-diperoxyesters of the formula: ##STR1## where R is selected from methyl and ethyl; R.sub.1 is ethyl when R is ethyl; R.sub.1 is hydroxyalkyl of 1 to 7 carbon atoms when R is methyl; and each R.sub.2 is ##STR2## where each of R.sub.3, R.sub.4, and R.sub.5 is selected from hydrogen and alkyl, provided not more than one of R.sub.3, R.sub.4, and R.sub.5 is hydrogen, R.sub.3, R.sub.4, and R.sub.5 collectively containing from 2 to 12 carbon atoms.The compounds are particularly efficient at varying temperatures from ambient to 60.degree. C. for the initiation of the polymerization of vinyl chloride. They also have high efficiency in the curing of polyester resins and in the polymerization of other monomers and comonomers having ethylenic unsaturation.