Abstract: Radio frequency (RF) circuitry and methods of operating the same are disclosed. In some embodiments, the RF circuitry includes a circuit package. The circuit package includes a package substrate, a first RF circuit, and a second RF circuit. The package substrate has a package body and a metallic structure integrated within the package body, wherein the metallic structure has a ground plane that defines a gap. The first RF circuit is cascaded with the second RF circuit such that a section of a RF signal line that connects the first RF circuit to the second RF circuit is directly above the gap in the ground plane. The circuit package may be mounted on a printed circuit (PC) board. The gap allows the electric field of the trace that connects the RF circuits to see the ground plane outside of the package, reducing the impact of the common ground inductance.

Abstract: Multi-layer electrical structures are disclosed. In one aspect, an electrical structure in a multi-layer structure such as a metalized laminate is stacked such that multiple electrical structures can be provided in the same footprint. In particular aspects, the multiple electrical structures are identical and placed electrically in parallel with one another to assist in creating a desired impedance. In still further particular aspects, the multiple electrical structures are couplers used to split or combine a signal for an amplifier chain or other circuits in a transceiver. This arrangement provides a desired low impedance at a small footprint and may assist in providing more efficient impedance transformations in the amplifier chain.

Abstract: Filter circuits having a resonator-based filter and a magnetically-coupled filter are disclosed. A filter circuit is deployed with a resonator-based passband filter connected to a magnetically-coupled filter which mitigates or reduces flyback of the resonator-based filter. The magnetically-coupled filter can be a passband filter with a relatively low insertion loss. The magnetically-coupled filter can be designed to mitigate flyback of the resonator-based filter by attenuating frequency response at selected frequency ranges.

Abstract: The present disclosure relates to a substrate that includes a substrate body and a resonator integrated within the substrate body. The resonator includes a resonator body, a top resonator plate, and a bottom resonator plate. The resonator body extends through the substrate body from a top surface to a bottom surface of the substrate body, and is formed of at least one of a dielectric material and a magnetic material. The top resonator plate is coupled to a top side of the resonator body and resides over the top surface of the substrate body, and the bottom resonator plate is coupled to a bottom side of the resonator body and resides over the bottom surface of the substrate body. The top resonator plate and the bottom resonator plate are electrically conductive.

Abstract: A Bulk Acoustic Wave (BAW) filter includes a series branch coupled between an input node and an output node. The series branch has multiple BAW resonators that are coupled in series, wherein a first series resonator is coupled between a first node and a second node in the series branch. A first shunt resonator is coupled between the first node and a fixed voltage node, such as ground, and a second shunt resonator is coupled between the second node and the fixed voltage node. Further, a first inductor is coupled between the first node and the fixed voltage node, and a second inductor is coupled between the second node and the fixed voltage node. The first inductor and the second inductor are magnetically coupled to one another to generate a virtual inductance between the first node and the second node and in parallel with the first series resonator.

Abstract: The present disclosure relates to a substrate that includes a substrate body and a resonator integrated within the substrate body. The resonator includes a resonator body, a top resonator plate, and a bottom resonator plate. The resonator body extends through the substrate body from a top surface to a bottom surface of the substrate body, and is formed of at least one of a dielectric material and a magnetic material. The top resonator plate is coupled to a top side of the resonator body and resides over the top surface of the substrate body, and the bottom resonator plate is coupled to a bottom side of the resonator body and resides over the bottom surface of the substrate body. The top resonator plate and the bottom resonator plate are electrically conductive.

Abstract: Filter circuits having a resonator-based filter and a magnetically-coupled filter are disclosed. A filter circuit is deployed with a resonator-based passband filter connected to a magnetically-coupled filter which mitigates or reduces flyback of the resonator-based filter. The magnetically-coupled filter can be a passband filter with a relatively low insertion loss. The magnetically-coupled filter can be designed to mitigate flyback of the resonator-based filter by attenuating frequency response at selected frequency ranges.

Abstract: A Bulk Acoustic Wave (BAW) filter includes a series branch coupled between an input node and an output node. The series branch has multiple BAW resonators that are coupled in series, wherein a first series resonator is coupled between a first node and a second node in the series branch. A first shunt resonator is coupled between the first node and a fixed voltage node, such as ground, and a second shunt resonator is coupled between the second node and the fixed voltage node. Further, a first inductor is coupled between the first node and the fixed voltage node, and a second inductor is coupled between the second node and the fixed voltage node. The first inductor and the second inductor are magnetically coupled to one another to generate a virtual inductance between the first node and the second node and in parallel with the first series resonator.

Abstract: Embodiments of the present invention may provide for high-performing inductor structures utilizing multi-layer organic stackups. In particular, these high-performing inductor structures may be formed of one or more stitched metal layer building blocks, which are each formed of at least two inductor sections that are vertically or horizontally aligned, and then stitched or connected together. This stitching process significantly reduces the DC/RF losses while reducing the inductance value by a substantially lower factor, thereby significant increasing the Q-factor of the resulting inductor structure. Each stitched metal layer building block may be formed on an organic dielectric layer (e.g., liquid crystalline polymer (LCP)) having a first conductive layer on a first surface and perhaps a second conductive layer on a second surface opposite the first surface.

Abstract: Embodiments of the present invention may provide for high-performing inductor structures utilizing multi-layer organic stackups. In particular, these high-performing inductor structures may be formed of one or more stitched metal layer building blocks, which are each formed of at least two inductor sections that are vertically or horizontally aligned, and then stitched or connected together. This stitching process significantly reduces the DC/RF losses while reducing the inductance value by a substantially lower factor, thereby significant increasing the Q-factor of the resulting inductor structure. Each stitched metal layer building block may be formed on an organic dielectric layer (e.g., liquid crystalline polymer (LCP)) having a first conductive layer on a first surface and perhaps a second conductive layer on a second surface opposite the first surface.