Patents by Inventor Lawrence A. Lehman

Lawrence A. Lehman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure to accommodate increase in volume expansion during solder reflow
    Publication number: 20060208030
    Abstract: Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.
    Type: Application
    Filed: May 24, 2006
    Publication date: September 21, 2006
    Applicant: International Business Machines Corporation
    Inventors: David Caletka, Krishna Darbha, Donald Henderson, Lawrence Lehman, George Thiel
  • Ground cotton retriever with dual cleaning means
    Patent number: 4497088
    Abstract: An improved cotton cleaner incorporating a cleaning mechanism utilizing successive stages of saw-tooth drums and transverse bars. The physical orientation of individual cotton balls is controlled to assure exposure of at least two sides of each cotton ball to the cleaning action.
    Type: Grant
    Filed: December 27, 1983
    Date of Patent: February 5, 1985
    Assignee: Ultra Harvesters, Inc.
    Inventor: Lawrence A. Lehman