Patents by Inventor Lawrence Allen Godfrey

Lawrence Allen Godfrey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reduced thickness and reduced footprint semiconductor packaging
    Patent number: 9117721
    Abstract: Semiconductor devices and methods for forming semiconductor devices are presented. A device formed of a semiconductor material is configured to mount upon a substrate layer surface having a substrate layer wire attach pad. The device includes a top planar surface with an electrically active region, and a bottom planar surface disposed substantially parallel to the top planar surface. A shelf region is disposed between the top planar surface and the bottom planar surface, and a device wire attach pad in electrical communication with the active region is located on the shelf region.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: August 25, 2015
    Assignee: Excelitas Canada, Inc.
    Inventors: Lawrence Allen Godfrey, Arthur John Barlow