Patents by Inventor Lawrence C. Lei
Lawrence C. Lei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9031685Abstract: A method and apparatus for atomic layer deposition (ALD) is described. In one embodiment, an apparatus comprises a vacuum chamber body having a contiguous internal volume comprised of a first deposition region spaced-apart from a second deposition region, the chamber body having a feature operable to minimize intermixing of gases between the first and the second deposition regions, a first gas port formed in the chamber body and positioned to pulse gas preferentially to the first deposition region to enable a first deposition process to be performed in the first deposition region, and a second gas port formed in the chamber body and positioned to pulse gas preferentially to the second deposition region to enable a second deposition process to be performed in the second deposition region is provided.Type: GrantFiled: January 7, 2014Date of Patent: May 12, 2015Assignee: Applied Materials, Inc.Inventors: Barry L. Chin, Alfred W. Mak, Lawrence C. Lei, Ming Xi, Hua Chung, Ken Kaung Lai, Jeong Soo Byun
-
Publication number: 20140130739Abstract: A method and apparatus for atomic layer deposition (ALD) is described. In one embodiment, an apparatus comprises a vacuum chamber body having a contiguous internal volume comprised of a first deposition region spaced-apart from a second deposition region, the chamber body having a feature operable to minimize intermixing of gases between the first and the second deposition regions, a first gas port formed in the chamber body and positioned to pulse gas preferentially to the first deposition region to enable a first deposition process to be performed in the first deposition region, and a second gas port formed in the chamber body and positioned to pulse gas preferentially to the second deposition region to enable a second deposition process to be performed in the second deposition region is provided.Type: ApplicationFiled: January 7, 2014Publication date: May 15, 2014Inventors: Barry L. CHIN, Alfred W. MAK, Lawrence C. LEI, Ming XI, Hua CHUNG, Ken Kaung LAI, Jeong Soo BYUN
-
Patent number: 8342119Abstract: The invention provides a removable first edge ring configured for pin and recess/slot coupling with a second edge ring disposed on the substrate support. In one embodiment, a first edge ring includes a plurality of pins, and a second edge ring includes one or more alignment recesses and one or more alignment slots for mating engagement with the pins. Each of the alignment recesses and alignment slots are at least as wide as the corresponding pins, and each of the alignment slots extends in the radial direction a length that is sufficient to compensate for the difference in thermal expansion between the first edge ring and the second edge ring.Type: GrantFiled: October 10, 2007Date of Patent: January 1, 2013Assignee: Applied Materials, Inc.Inventors: Joseph Yudovsky, Lawrence C. Lei, Salvador Umotoy, Tom Madar, Girish Dixit, Gwo-Chuan Tzu
-
Patent number: 7923069Abstract: A multi-station deposition apparatus capable of simultaneous processing multiple substrates using a plurality of stations, where a gas curtain separates the stations. The apparatus further comprises a multi-station platen that supports a plurality of wafers and rotates the wafers into specific deposition positions at which deposition gases are supplied to the wafers. The deposition gases may be supplied to the wafer through single zone or multi-zone gas dispensing nozzles.Type: GrantFiled: August 20, 2010Date of Patent: April 12, 2011Assignee: Applied Materials, Inc.Inventors: Mei Chang, Lawrence C. Lei, Walter B. Glenn
-
Publication number: 20100316800Abstract: A multi-station deposition apparatus capable of simultaneous processing multiple substrates using a plurality of stations, where a gas curtain separates the stations. The apparatus further comprises a multi-station platen that supports a plurality of wafers and rotates the wafers into specific deposition positions at which deposition gases are supplied to the wafers. The deposition gases may be supplied to the wafer through single zone or multi-zone gas dispensing nozzles.Type: ApplicationFiled: August 20, 2010Publication date: December 16, 2010Inventors: Mei Chang, Lawrence C. Lei, Walter B. Glenn
-
Patent number: 7794789Abstract: A multi-station deposition apparatus capable of simultaneous processing multiple substrates using a plurality of stations, where a gas curtain separates the stations. The apparatus further comprises a multi-station platen that supports a plurality of wafers and rotates the wafers into specific deposition positions at which deposition gases are supplied to the wafers. The deposition gases may be supplied to the wafer through single zone or multi-zone gas dispensing nozzles.Type: GrantFiled: May 5, 2009Date of Patent: September 14, 2010Assignee: Applied Materials, Inc.Inventors: Mei Chang, Lawrence C. Lei, Walter B. Glenn
-
Patent number: 7777483Abstract: A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.Type: GrantFiled: April 8, 2008Date of Patent: August 17, 2010Assignee: Applied Materials, Inc.Inventors: Lawrence C. Lei, Siqing Lu, Yu Chang, Cecilia Martner, Quyen Pham, Yu Ping Gu, Joel Huston, Paul Smith, Gabriel Lorimer Miller
-
Publication number: 20090214786Abstract: A multi-station deposition apparatus capable of simultaneous processing multiple substrates using a plurality of stations, where a gas curtain separates the stations. The apparatus further comprises a multi-station platen that supports a plurality of wafers and rotates the wafers into specific deposition positions at which deposition gases are supplied to the wafers. The deposition gases may be supplied to the wafer through single zone or multi-zone gas dispensing nozzles.Type: ApplicationFiled: May 5, 2009Publication date: August 27, 2009Inventors: Mei Chang, Lawrence C. Lei, Walter B. Glenn
-
Patent number: 7547465Abstract: A multi-station deposition apparatus capable of simultaneous processing multiple substrates using a plurality of stations, where a gas curtain separates the stations. The apparatus further comprises a multi-station platen that supports a plurality of wafers and rotates the wafers into specific deposition positions at which deposition gases are supplied to the wafers. The deposition gases may be supplied to the wafer through single zone or multi-zone gas dispensing nozzles.Type: GrantFiled: August 5, 2005Date of Patent: June 16, 2009Assignee: Applied Materials, Inc.Inventors: Mei Chang, Lawrence C. Lei, Walter B. Glenn
-
Publication number: 20080186022Abstract: A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.Type: ApplicationFiled: April 8, 2008Publication date: August 7, 2008Inventors: Lawrence C. Lei, Siqing Lu, Yu Chang, Cecilia Martner, Quyen Pham, Yu Ping Gu, Joel Huston, Paul Smith, Gabriel Lorimer Miller
-
Patent number: 7355394Abstract: A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.Type: GrantFiled: September 18, 2006Date of Patent: April 8, 2008Assignee: Applied Materials, Inc.Inventors: Lawrence C. Lei, Siqing Lu, Yu Chang, Cecilia Martner, Quyen Pham, Yu P. Gu, Joel Huston, Paul Smith, G. Lorimer Miller
-
Patent number: 7112961Abstract: A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.Type: GrantFiled: October 14, 2003Date of Patent: September 26, 2006Assignee: Applied Materials, Inc.Inventors: Lawrence C. Lei, Siqing Lu, Yu Chang, Cecilia Martner, Quyen Pham, Yu Ping Gu, Joel Huston, Paul Smith, Gabriel Lorimer Miller
-
Patent number: 6932871Abstract: A multi-station deposition apparatus capable of simultaneous processing multiple substrates using a plurality of stations, where a gas curtain separates the stations. The apparatus further comprises a multi-station platen that supports a plurality of wafers and rotates the wafers into specific deposition positions at which deposition gases are supplied to the wafers. The deposition gases may be supplied to the wafer through single zone or multi-zone gas dispensing nozzles.Type: GrantFiled: April 16, 2002Date of Patent: August 23, 2005Assignee: Applied Materials, Inc.Inventors: Mei Chang, Lawrence C. Lei, Walter B. Glenn
-
Patent number: 6866746Abstract: Embodiments of the present invention generally relate to a clamshell and small volume chamber with a fixed substrate support. One embodiment of a processing chamber includes a fixed substrate support having a substrate receiving surface, a pumping ring disposed around a perimeter of the substrate receiving surface, and a gas distribution assembly disposed over the fixed substrate support. The pumping ring forms at least a portion of a pumping channel and has one or more apertures formed therethrough. The chamber may further include a gas-flow diffuser disposed radially inward of the apertures of the pumping ring. Another embodiment of a processing chamber includes a first assembly comprising a fixed substrate support and a second assembly comprising a gas distribution assembly. The first assembly includes a first assembly body that is shaped and sized so that at least a portion of the first assembly body is below the substrate receiving surface of the substrate support.Type: GrantFiled: November 21, 2002Date of Patent: March 15, 2005Assignee: Applied Materials, Inc.Inventors: Lawrence C. Lei, Alfred W. Mak, Gwo-Chuan Tzu, Avi Tepman, Ming Xi, Walter Benjamin Glenn
-
Publication number: 20040170403Abstract: An apparatus and method for effectively and controllably vaporizing a solid precursor material is provided. In particular, the present invention provides an apparatus that includes a housing defining a sealed interior volume having an inlet for receiving a carrier gas, at least one surface within the housing for the application of a solid precursor, and a heating member for heating the solid precursor. The heating member can be located in the housing or in the surface within the housing. The surface can be a rod, baffle, mesh, or grating, and is preferably s-shaped or cone-shaped. Optionally, an outlet connects the housing to a reaction chamber. A method for vaporizing a solid precursor using the apparatus of the present invention is also provided.Type: ApplicationFiled: March 3, 2004Publication date: September 2, 2004Applicant: Applied Materials, Inc.Inventor: Lawrence C. Lei
-
Publication number: 20040140797Abstract: A method and apparatus are provided for measuring the thickness of a test object. The apparatus includes an eddy current sensor having first and second sensor heads. The sensor heads are positioned to have a predetermined gap therebetween for passage by at least a portion of the test object through the gap. The sensor heads make measurements at given sampling locations on the test object as the test object is moved through the gap. The apparatus also includes a position sensing mechanism to determine positions of the sampling locations on the test object. The apparatus also includes an evaluation circuit in communication with the eddy current sensor and to the position sensing mechanism for determining the thickness of the test object at the sampling locations.Type: ApplicationFiled: October 14, 2003Publication date: July 22, 2004Applicant: Applied Materials, Inc.Inventors: Lawrence C. Lei, Siqing Lu, Yu Chang, Cecilia Martner, Quyen Pham, Yu Ping Gu, Joel Huston, Paul Smith, Gabriel Lorimer Miller
-
Patent number: 6729824Abstract: A substrate processing system having a transfer chamber having two processing chambers and two load lock chambers coupled thereto is generally provided. The transfer chamber includes a body having a first transfer area and a second transfer area defined therein on either side of a center axis. A first passage couples one of the load locks with the first transfer area and a second passage couples the other one of the load locks with the second transfer area. The first passage and the second passage form an acute angle about the center axis. A transfer platform is disposed between the first transfer area and the second transfer area. A first transfer robot and a second transfer robot are disposed in the first and second transfer areas, respectively. Each robot is adapted to transfer substrates between the load locks, the transfer platform and a processing chamber.Type: GrantFiled: December 14, 2001Date of Patent: May 4, 2004Assignee: Applied Materials, Inc.Inventors: Lawrence C. Lei, Moris Kori
-
Patent number: 6718126Abstract: An apparatus and method for effectively and controllably vaporizing a solid precursor material is provided. In particular, the present invention provides an apparatus that includes a housing defining a sealed interior volume having an inlet for receiving a carrier gas, at least one surface within the housing for the application of a solid precursor, and a heating member for heating the solid precursor. The heating member can be located in the housing or in the surface within the housing. The surface can be a rod, baffle, mesh, or grating, and is preferably s-shaped or cone-shaped. Optionally, an outlet connects the housing to a reaction chamber. A method for vaporizing a solid precursor using the apparatus of the present invention is also provided.Type: GrantFiled: September 14, 2001Date of Patent: April 6, 2004Assignee: Applied Materials, Inc.Inventor: Lawrence C. Lei
-
Publication number: 20040003780Abstract: The invention provides a removable first edge ring configured for pin and recess/slot coupling with a second edge ring disposed on the substrate support. In one embodiment, a first edge ring includes a plurality of pins, and a second edge ring includes one or more alignment recesses and one or more alignment slots for mating engagement with the pins. Each of the alignment recesses and alignment slots are at least as wide as the corresponding pins, and each of the alignment slots extends in the radial direction a length that is sufficient to compensate for the difference in thermal expansion between the first edge ring and the second edge ring.Type: ApplicationFiled: July 7, 2003Publication date: January 8, 2004Applicant: APPLIED MATERIALS, INC.Inventors: Joseph Yudovsky, Lawrence C. Lei, Salvador Umotoy, Tom Madar, Girish Dixit, Gwo-Chuan Tzu
-
Publication number: 20030221780Abstract: Embodiments of the present invention generally relate to a clamshell and small volume chamber with a fixed substrate support. One embodiment of a processing chamber includes a fixed substrate support having a substrate receiving surface, a pumping ring disposed around a perimeter of the substrate receiving surface, and a gas distribution assembly disposed over the fixed substrate support. The pumping ring forms at least a portion of a pumping channel and has one or more apertures formed therethrough. The chamber may further include a gas-flow diffuser disposed radially inward of the apertures of the pumping ring. Another embodiment of a processing chamber includes a first assembly comprising a fixed substrate support and a second assembly comprising a gas distribution assembly. The first assembly includes a first assembly body that is shaped and sized so that at least a portion of the first assembly body is below the substrate receiving surface of the substrate support.Type: ApplicationFiled: November 21, 2002Publication date: December 4, 2003Inventors: Lawrence C. Lei, Alfred W. Mak, Gwo-Chuan Tzu, Avi Tepman, Ming Xi, Walter Benjamin Glenn