Patents by Inventor Lawrence Charles Hughes
Lawrence Charles Hughes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9865990Abstract: A method of characterizing a monolithic tunable mid-infrared laser including a heterogeneous quantum cascade active region together with a least first and a second tunable integrated distributed feedback gratings, the method including operating the laser while tuning the first grating through its full tuning range, while holding the reflectivity function of the second grating constant, then operating the laser while tuning the second grating through its full tuning range, while holding the reflectivity function of the first grating constant.Type: GrantFiled: May 20, 2016Date of Patent: January 9, 2018Assignee: Thorlabs Quantum Electronics, Inc.Inventors: Catherine Genevieve Caneau, Lawrence Charles Hughes, Feng Xie, Chung-En Zah
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Publication number: 20160268772Abstract: A method of characterizing a monolithic tunable mid-infrared laser including a heterogeneous quantum cascade active region together with a least first and a second tunable integrated distributed feedback gratings, the method including operating the laser while tuning the first grating through its full tuning range, while holding the reflectivity function of the second grating constant, then operating the laser while tuning the second grating through its full tuning range, while holding the reflectivity function of the first grating constant.Type: ApplicationFiled: May 20, 2016Publication date: September 15, 2016Inventors: Catherine Genevieve Caneau, Lawrence Charles Hughes, Feng Xie, Chung-En Zah
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Patent number: 9385509Abstract: A monolithic tunable mid-infrared laser has a wavelength range within the range of 3-14 ?m and comprises a heterogeneous quantum cascade active region together with at least a first integrated grating. The heterogeneous quantum cascade active region comprises at least one stack, the stack comprising two, desirably at least three differing stages. Methods of operating and calibrating the laser are also disclosed.Type: GrantFiled: May 29, 2015Date of Patent: July 5, 2016Assignee: Thorlabs Quantum Electronics, Inc.Inventors: Catherine Genevieve Caneau, Lawrence Charles Hughes, Jr., Feng Xie, Chung-En Zah
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Publication number: 20150270685Abstract: A monolithic tunable mid-infrared laser has a wavelength range within the range of 3-14 ?m and comprises a heterogeneous quantum cascade active region together with at least a first integrated grating. The heterogeneous quantum cascade active region comprises at least one stack, the stack comprising two, desirably at least three differing stages. Methods of operating and calibrating the laser are also disclosed.Type: ApplicationFiled: May 29, 2015Publication date: September 24, 2015Inventors: Catherine Genevieve Caneau, Lawrence Charles Hughes, JR., Feng Xie, Chung-En Zah
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Patent number: 8391330Abstract: Metallization patterns are provided to reduce the probability of chip fracture in semiconductor lasers. According to one embodiment disclosed herein, the pad edges of a metallization pattern extend across a plurality of crystallographic planes in the laser substrate. In this manner, cracks initiated at any given stress concentration would need to propagate across many crystallographic planes in the substrate to reach a significant size. Additional embodiments of the present disclosure relate to the respective geometries and orientations of adjacent pairs of contact pads. Still further embodiments are disclosed and claimed.Type: GrantFiled: April 20, 2009Date of Patent: March 5, 2013Assignee: Corning IncorporatedInventors: Satish Chandra Chaparala, Martin Hai Hu, Lawrence Charles Hughes, Jr., Chung-En Zah
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Patent number: 8102887Abstract: Particular embodiments of the present disclosure bring an SHG crystal, or other type of wavelength conversion device, into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser source subassembly comprising a laser base and a wavelength conversion device subassembly comprising a converter base. The bonding interface of the laser base is bonded the complementary bonding interface of the converter base such that the laser output face can be proximity-coupled to the converter input face at an predetermined interfacial spacing x. Additional embodiments are disclosed and claimed.Type: GrantFiled: May 26, 2009Date of Patent: January 24, 2012Assignee: Corning IncorporatedInventors: Venkata Adiseshaiah Bhagavatula, Satish Chandra Chaparala, John Himmelreich, Lawrence Charles Hughes, Jr.
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Publication number: 20110267682Abstract: Particular embodiments of the present disclosure bring an SHG crystal, or other type of wavelength conversion device, into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser source and a wavelength conversion device. The laser source is positioned such that the output face of the laser source is proximity-coupled to a waveguide portion of the input face of the wavelength conversion device. The input face of the wavelength conversion device comprises an ?-cut facet and ?-cut facet. The ?-cut facet of the input face is oriented at a horizontal angle ?, relative to the waveguide of the wavelength conversion device to permit proximity coupling of the output face of the laser source and the input face of the wavelength conversion device.Type: ApplicationFiled: July 8, 2011Publication date: November 3, 2011Applicant: CORNING INCORPORATEDInventors: Venkata Adisehaiah Bhagavatula, Satish Chandra Chaparala, John Himmelreich, Lawrence Charles Hughes, JR.
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Publication number: 20110129189Abstract: Embodiments of the present disclosure bring a wavelength conversion device into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser diode chip and a clad metal substrate. The clad metal substrate comprises a clad metal region that is mechanically coupled to a base metal region. The laser diode chip is coupled to the clad metal region. The clad metal region comprises a clad metal material having a thermal conductivity that is greater than a thermal conductivity of the base metal material. The clad metal region further comprises a coefficient of thermal expansion that is approximately equal to a coefficient of thermal expansion of the base metal material and is greater than a coefficient of thermal expansion of the laser diode chip.Type: ApplicationFiled: November 30, 2009Publication date: June 2, 2011Inventors: Venkata Adiseshaiah Bhagavatula, Satish Chandra Chaparala, John Himmelreich, Lawrence Charles Hughes, JR.
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Publication number: 20100303109Abstract: Particular embodiments of the present disclosure bring an SHG crystal, or other type of wavelength conversion device, into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser source and a wavelength conversion device. The laser source is positioned such that the output face of the laser source is proximity-coupled to a waveguide portion of the input face of the wavelength conversion device. The input face of the wavelength conversion device comprises an ?-cut facet and ?-cut facet. The ?-cut facet of the input face is oriented at a horizontal angle ?, relative to the waveguide of the wavelength conversion device to permit proximity coupling of the output face of the laser source and the input face of the wavelength conversion device.Type: ApplicationFiled: May 26, 2009Publication date: December 2, 2010Inventors: Venkata Adiseshaiah Bhagavatula, Satish Chandra Chaparala, John Himmelreich, Lawrence Charles Hughes, JR.
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Publication number: 20100303110Abstract: Particular embodiments of the present disclosure bring an SHG crystal, or other type of wavelength conversion device, into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser source subassembly comprising a laser base and a wavelength conversion device subassembly comprising a converter base. The bonding interface of the laser base is bonded the complementary bonding interface of the converter base such that the laser output face can be proximity-coupled to the converter input face at an predetermined interfacial spacing x. Additional embodiments are disclosed and claimed.Type: ApplicationFiled: May 26, 2009Publication date: December 2, 2010Inventors: Venkata Adiseshaiah Bhagavatula, Satish Chandra Chaparala, John Himmelreich, Lawrence Charles Hughes, JR.
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Publication number: 20100265982Abstract: Metallization patterns are provided to reduce the probability of chip fracture in semiconductor lasers. According to one embodiment disclosed herein, the pad edges of a metallization pattern extend across a plurality of crystallographic planes in the laser substrate. In this manner, cracks initiated at any given stress concentration would need to propagate across many crystallographic planes in the substrate to reach a significant size. Additional embodiments of the present disclosure relate to the respective geometries and orientations of adjacent pairs of contact pads. Still further embodiments are disclosed and claimed.Type: ApplicationFiled: April 20, 2009Publication date: October 21, 2010Inventors: Satish Chandra Chaparala, Martin Hai Hu, Lawrence Charles Hughes, JR., Chung-En Zah
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Publication number: 20090190624Abstract: An optical package includes a semiconductor laser, a wavelength conversion device and a MEMS-actuated mirror oriented on a base module to form a folded optical pathway between an output of the semiconductor laser and an input of the wavelength conversion device. An optical assembly is located in a mechanical positioning device and the mechanical positioning device is disposed on the base module along the optical pathway such that the beam of the semiconductor laser passes through the optical assembly, is reflected by the MEMS-actuated mirror back through the optical assembly and into the waveguide portion of the wavelength conversion device. The MEMS-actuated mirror is operable to scan the beam of the semiconductor laser over the input of the wavelength conversion device. The optical assembly may be adjusted along the optical pathway with the mechanical positioning device to focus the beam into the waveguide portion of the wavelength conversion device.Type: ApplicationFiled: August 28, 2008Publication date: July 30, 2009Inventors: Etienne Almoric, Jacques Gollier, Lawrence Charles Hughes, JR., Garrett Andrew Piech
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Patent number: 7480432Abstract: Glass-based micropositioning systems and methods are disclosed. The micropositioning systems and methods utilize microbumps (40) formed in a glass substrate (12 or 100). The microbumps are formed by subjecting a portion of the glass substrate to localized heating, which results in local rapid expansion of glass where the heat was applied. The height and shape of the microbumps depend on the type of glass substrate and the amount and form of heat delivered to the substrate. The microbumps allow for active or passive micropositioning of optical elements, including planar waveguides and optical fibers. Optical assemblies formed using microbump micropositioners are also disclosed.Type: GrantFiled: February 28, 2006Date of Patent: January 20, 2009Assignee: Corning IncorporatedInventors: Richard R Grzybowski, Brewster Roe Hemenway, Jr., Lawrence Charles Hughes, Jr., Stephan Lvovich Logunov, Kamjula Pattabhirami Reddy, Joseph Francis Schroeder, III, James Scott Sutherland, Alexander M. Streltsov
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Patent number: 7258495Abstract: The present invention relates to lensed fiber stub assemblies and optical and optoelectronic packages including them. The fiber stub assemblies include a section of lensed fiber having a lensed end having a lens face, and a distal end having an endface, a lens alignment ferrule affixed to and holding the lensed end of the lensed fiber, and a package attachment ferrule having a distal endface and an exterior surface, the package attachment ferrule affixed to and holding the distal end of the lensed fiber. The lensed fiber stub assemblies of the present invention allow for hermetic packaging of optical and optoelectronic devices, good manufacturing throughput, facile package connectorization, acceptable device thermal performance, and ease of alignment in the packaging process.Type: GrantFiled: June 26, 2006Date of Patent: August 21, 2007Assignee: Corning IncorporatedInventors: Lawrence Charles Hughes, Jr., Karen Irene Matthews, William James Miller
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Patent number: 6731853Abstract: An optical fiber clamp that precisely aligns and clamps multiple optical fibers in multi-channel freespace optical systems, eliminates multiple parts and simplifies assembly. Multiple wafers each having an array of holes passing therethrough, are aligned with respect to each other. Optical fibers are passed through the holes, and at least one of the wafers is moved laterally with respect to the other wafers, so that sidewalls of the holes clamp the optical fibers into a desired location.Type: GrantFiled: August 14, 2001Date of Patent: May 4, 2004Assignee: Corning IncorporartedInventors: Robert A. Boudreau, Chris P. Brophy, Lawrence Charles Hughes, Jr., Mark F. Krol, Deepukumar M. Nair, Songsheng Tan, Aniruddha S. Weling
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Publication number: 20020131752Abstract: An optical fiber clamp that precisely aligns and clamps multiple optical fibers in multi-channel freespace optical systems, eliminates multiple parts and simplifies assembly. Multiple wafers each having an array of holes passing therethrough, are aligned with respect to each other. Optical fibers are passed through the holes, and at least one of the wafers is moved laterally with respect to the other wafers, so that sidewalls of the holes clamp the optical fibers into a desired location.Type: ApplicationFiled: August 14, 2001Publication date: September 19, 2002Inventors: Robert A. Boudreau, Chris P. Brophy, Lawrence Charles Hughes, Mark F. Krol, Deepukumar M. Nair, Songsheng Tan, Aniruddha S. Weling