Abstract: A method of fabricating a monolithic device, preferably a micromechanical device, from a wafer (20) by carefully selecting the composition of two or more layers of photoresist (52,54). The present invention uses a superhard protective layer such as DLC or TiW deposited over the partially fabricated device prior to a partial-saw. This superhard protective layer reduces the generation of defects in the underlying photoresist layers, and allows a wet chemical HF acid to etch away particles and damage of the underlying oxide edges. A 6% BHF solution can be utilized. The present invention substantially improves the yield of micromechanical devices.

Abstract: A method of fabricating a monolithic device, preferably a micromechanical device, from a wafer (20) by carefully selecting the composition of two or more layers of photoresist (52,54). The present invention comprises choosing compatible photoresist layers to avoid generating defects in the layers of photoresist which could allow a wet chemical HF acid etch process to damage an underlying micromechanical device. The present invention allows a very strong solution of hydrofluoric acid to be utilized to remove particles and debris after a partial-saw process, and to remove a damaged portion of an underlying CMOS layer (22) at a region (68) proximate a kerf (62). Using an HF solution having a concentration of about 6% is desired. The present invention substantially improves the yield of micromechanical devices.

Abstract: A method of separating wafers, such as those used for semiconductor device manufacture, into die. A partly fabricated wafer is covered with a protective coating over its top surface (10). The wafer is then inscribed to define separation lines between die, with the separation lines being of a predetermined depth (12). The protective coating is then removed (14), and at least one processing step is performed at the wafer level (15, 22-24), before the inscribed wafer is separated into die. Then, the wafer is separated into die along the separation lines (17).

Abstract: An edge polishing system (20, 320) and method for edge polishing semiconductor wafers is disclosed. The system (20, 320) includes a loader (22, 326), a polisher (24, 328), an unloader (26, 330), and a controller (28, 335). The method includes the steps of loading wafers (28), and spacers (30) into a loader (22) to form a stack (36), moving the stack (36) into a polisher (24) and causing polisher (24) to polish the stack (36), then moving the stack (36) to an unloader (26), which semiautomatically removes the wafers (28) and spacers (30). The system (20) may include a controller (28) for entering the appropriate commands.

Abstract: The protection to the backside of the semiconductor wafer is accomplished by applying a layer of silicon oxide or silicon nitride or other deposited material to the back surface of a semiconductor wafer to protect against particles, scratches, and etching by mild caustic solutions. The layer remains in place during all three processes, edge pre-polish, mirror edge polish, and wafer polish.

Abstract: An apparatus and method of contouring the edge of a semiconductor wafer in a fiduciary mark notch utilizes a contouring wheel or burr having a smaller diameter than the diameter of the fiduciary mark notch.

Abstract: A system and method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.

Abstract: An apparatus stacks semiconductor wafers and spacers and clamps them in an axial alignment for mounting in a semiconductor wafer edge polishing machine. After edge polishing, the apparatus separates the wafers and spacers and delivers them respectively into separate cassettes for further processing or recycling.

Abstract: A method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.

Abstract: Trace quantities of elemental iodine are added to deionized water used in the manufacture of semiconductor materials and devices in order to sterilize the water and the delivery system of microscopic life forms, and to leave the iodine in the flow all the way through processing except for those process steps where iodine may be detrimental to the process step.

Abstract: A system and method for controlling the tension of an internal diameter saw blade by controlling the temperature of the blade while it is still rotating. The blade temperature is controlled by regulating the temperature of the wash water flow associated therewith. In one embodiment blade tension is periodically measured and, when the tension falls below a predetermined limit, the temperature of the wash water stream is decreased for a period of time until the tension increases to a preselected value.

Abstract: A system and method for reducing kerf loss and controlling the tension and lateral vibration of an internal diameter saw blade by controlling the temperature of the blade while it is still rotating. The blade temperature is controlled by regulating the temperature of the cutting fluid flow associated therewith. In one embodiment blade tension is periodically measured and, when the tension falls below a predetermined limit, the temperature of the cutting fluid stream is decreased for a period of time until the tension increases to a preselected value.

Abstract: A system for measuring the flexure of a saw blade in situ includes in one embodiment a non-contact displacement sensor and means for directing a fluid flow at the blade adjacent the sensor. The deflection of the blade by the fluid flow is detected by the sensor which generates a signal related to blade flexure. The system indicates when a saw blade is correctly tensioned or when retensioning is required.