Abstract: A compact multilayer signal processing system. In the illustrative embodiment, the system is adapted for use with microwave signals. The system includes a first mechanism for receiving an input signal and selectively routing the input signal onto a first signal path. A second mechanism routes the input signal along the first signal path vertically through one or more layers to a first circuit component. The first circuit component outputs an adjusted signal in response to receipt of the input signal. A third mechanism directs the adjusted signal to the output of the system. In a specific embodiment, the one or more layers include one or more groundplane layers. In this embodiment, the first mechanism includes an input switching network in communication with a controller. The switching network is positioned on a switching layer and communicates with one or more controllers to facilitate selectively switching the input signal onto one of plural input signal paths.

Abstract: A compact multilayer signal processing system. In the illustrative embodiment, the system is adapted for use with microwave signals. The system includes a first mechanism for receiving an input signal and selectively routing the input signal onto a first signal path. A second mechanism routes the input signal along the first signal path vertically through one or more layers to a first circuit component. The first circuit component outputs an adjusted signal in response to receipt of the input signal. A third mechanism directs the adjusted signal to the output of the system. In a specific embodiment, the one or more layers include one or more groundplane layers. In this embodiment, the first mechanism includes an input switching network in communication with a controller. The switching network is positioned on a switching layer and communicates with one or more controllers to facilitate selectively switching the input signal onto one of plural input signal paths.

Abstract: A multi-channel microwave switched filter bank, wherein the input circuitry and output circuitry are mounted on opposite sides of the filter bank, providing a compact structure with excellent isolation. The filter bank includes a set of microwave band pass filter circuits. A housing structure provides an outer conductive peripheral frame structure. A rack structure disposed within the housing structure has a plurality of elongated slots for mounting therein corresponding ones of the plurality of filter circuits. A top dielectric substrate board is mounted adjacent a first side of the rack structure and has a first set of openings formed therein for providing access to a first set of input/output (I/O) ports of the plurality of filter circuits. A bottom dielectric substrate board is mounted adjacent a second side of the rack structure opposite the first side and has a second set of openings formed therein for providing access to a second set of input/output (I/O) ports of the plurality of filter circuits.

Abstract: A compact thick film substrate for filtering, shielding, and routing multiple lines of dc and control signals between isolated ports of a microwave integrated circuit. The substrate circuit includes a dielectric substrate having upper and lower substrate surfaces and first and second side surfaces. A first ground plane layer is formed on the upper substrate surface.