Abstract: Method for fabrication of damascene interconnects and related structures is disclosed. A sacrificial layer is formed over a low-k dielectric. Trenches are then etched inside the sacrificial layer and the low-k dielectric. The trenches are then filled with metal. During a first CMP process, excess metal over the sacrificial layer is removed. During a second CMP process, the sacrificial layer over the low-k dielectric and any remaining excess metal are removed. By the end of the second CMP process substantially all of the sacrificial layer and all of the excess metal are removed. In this manner, the trenches in the low-k dielectric are filled with metal where the metal surface is substantially flush with the surface of the low-k dielectric.