Abstract: A power electronics package includes a heat exchanger having a plurality of faces, a plurality of semiconductor devices mounted on the plurality of faces and at least one bus structure for interconnecting electrodes of the semiconductor devices. The package is enclosed by a cover and structure is provided to connect other electrodes of the semiconductor devices to an external circuit. The heat exchanger is of the jet impingement type.

Abstract: A power electronics package includes a heat exchanger having a plurality of faces, a plurality of semiconductor devices mounted on the plurality of faces and at least one bus structure for interconnecting electrodes of the semiconductor devices. The package is enclosed by a cover and structure is provided to connect other electrodes of the semiconductor devices to an external circuit.

Abstract: This invention relates to an electric power generation and distribution system, and more particularly to an electric power distribution module for use in such systems, having an insulative support structure which includes integral therewith electrically conductive means which define a circuit for distributing electric power received from one or more power sources to one or more electrical loads, the insulative support structure also including integral therewith current sensing means for sensing a flow of electrical current in the electrically conductive means.

Abstract: A cooling system for first and second components operable at first and second maximum temperatures includes a first coolant path and heat transfer relationship with the first component and a second coolant path in heat transfer relationship with the second component and the first coolant path. The second coolant path removes heat from the second component and the first coolant path removes heat from the first component and the second coolant path so that the first and second components are maintained at temperatures less than the first and second maximum temperatures, respectively.

Abstract: The inverter module according to the present invention includes a component support for supporting components attached thereto, an AC/DC converter attached to the support for converting input AC into DC, inverter switches attached to the support for inverting the DC into single-phase output AC, a switch controller attached to the support for controlling the inverter switches, and connectors for interconnecting the AC/DC converter, the inverter switches, and the switch controller so that input AC is converted to a single phase of output AC.

Abstract: Prior power converters have utilized discrete components mounted on circuit boards of differing designs. Failure of one or more of the components requires testing each component to determine which is faulty. The faulty component must then be replaced. This results in significant down time for the inverter and can require stocking a large number of specialized boards. In order to overcome these problems, an inverter is assembled using modular circuit boards. Each circuit board includes components mounted on a multilayer substrate and a heat exchanger which cools high power components. When a malfunction of a component occurs, the entire board containing the failed component may be readily replaced so that inverter down time is minimized. The use of modular circuit boards also reduces stocking requirements and inventory costs.

Abstract: A method of manufacturing hermetically sealed circuit assemblies (10) having circuit elements (74, 76, 78 and 80) to be compression bonded, a hermetically sealed circuit assembly having circuit elements to be compression bonded and a stack containing at least one hermetically sealed circuit assembly having circuit elements which are compression bonded is disclosed. Uniform thickness of individual hermetically sealed circuit assemblies measured across columns (22-30) is insured by positioning deformable spacers (124-132) in the columns containing the circuit elements to be compression bonded, and deforming the deformable spacers so that a surface of each of the deformed spacers lies within a single plane. Thereafter a compressive force is applied to a stack of one or more circuits through the columns which contain the circuit elements to be compression bonded.

Abstract: A hermetically sealed circuit assembly having circuit elements to be compression bonded and a stack containing at least one hermetically sealed circuit assembly having circuit elements which are compression bonded is disclosed. Uniform thickness of individual hermetically sealed circuit assemblies measured across columns is insured by positioning deformable spacers in the columns containing the circuit elements to be compression bonded, and deforming the deformable spacers so that a surface of each of the deformed spacers lies within a single plane. Thereafter a compressive force is applied to a stack or one or more circuits through the columns which contain the circuit elements to be compression bonded.

Abstract: A harmetically sealed circuit assembly (10) containing a plurality of circuit elements (74, 76 and 80) which are to be compression bonded upon application of a force through opposed first and second walls (12, 20) of a hermetically sealed chamber containing the circuit elements to be compression bonded in accordance with the invention includes a plurality of columns (20-30) within the chamber with each circuit element to be compression bonded being disposed in a separate column; an inelastically deformed element (124-132) positioned in each of the columns outside the chamber having a first surface facing an outside surface of one of the first and second walls of the hermetically sealed chamber and a second surface with each of the second surfaces of the deformed springs facing an outside surface of another of the first and second walls; and a thickness of the columns measured between the outside surfaces of the first and second walls prior to compression bonding being substantially identical.

Abstract: Prior power converters have utilized discrete components mounted on circuit boards of different design. Failure of one or more of the components requires the components to be separately tested to determine which is faulty. The faulty component or the board containing same must then be replaced. This results in significant down time for the inverter and can require stocking of a large number of specialized boards. In order to overcome these problems, an inverter is assembled using a series of circuit boards of standardized type. Each circuit board includes separate layers which interconnect components mounted thereon together with a heat exchanger which cools high power components. When a malfunction of a component occurs, the entire board may be replaced so that inverter down time is minimized. Also, the use of standardized boards reduces stocking requirements and inventory costs.

Abstract: Prior power converters have utilized discrete components mounted on circuit boards of different design. Failure of one or more of the components requires the components to be separately tested to determine which is faulty. The faulty component or the board containing same must then be replaced. This results in significant down time for the inverter and can require stocking of a large number of specialized boards. In order to overcome these problems, an inverter is assembled using a series of circuit boards of standardized type. Each circuit board includes separate layers which interconnect components mounted thereon together with a heat exchanger which cools high power components. When a malfunction of a component occurs, the entire board may be replaced so that inverter down time is minimized. Also, the use of standardized boards reduces stocking requirements and inventory costs.

Abstract: A power converter comprises a plurality of modular circuit boards assembled in a stacked relationship. The circuit boards include heat exchangers which are interconnected and cooling fluid is provided thereto to remove heat generated by high power devices.

Abstract: A method of manufacturing hermetically sealed circuit assemblies (10) having circuit elements (74, 76, 78 and 80) to be compression bonded, a hermetically sealed circit assembly having circuit elements to be compression bonded and a stack containing at least one hermetically sealed circuit assembly having circuit elements which are compression bonded is disclosed. Uniform thickness of individual hermetically sealed circuit assemblies measured across columns (22-30) is insured by positioned deformable spacers (124-132) in the columns containing the circuit elements to be compression bonded, and deforming the deformable spacers so that a surface of each of the deformed spacers lies within a single plane. Thereafter a compressive force is applied to a stack of one or more circuits through the columns which contain the circuit elements to be compression bonded.

Abstract: A modular reflux cooling plate (10) having a condensing region (11), boiling channels (12) and downcomers (16) which effect reflux cooling of electrical power modules used in aircraft and the like. The condenser (11) and boiling channels (12) can be constituted by longitudinally disposed lanced offset fins (20). Air flow fins (18) are arranged adjacent the condenser (11) to effect cooling of a coolant vapor which has entered the condenser (11) after being boiled from a liquid state in the boiling channels (12) as a result of the heat generated by one or more power modules affixed to an end plate (14) by any suitable means. Temporary thermal storage can be provided in the form of either a thickened end plate (14) or a chamber having lanced offset fins (25) and a normally solid or semi-solid material such as wax or solder.

Abstract: A modular reflux cooling plate (10) having a condenser region (11) above the boiling channels (12) or above and below (11,24) the region (11), boiling channels (12) and downcomers (16) which effect reflux cooling of electrical power modules used in aircraft and the like. Air flow fins (18) are arranged adjacent the condenser (11) or condensers (11,24) and the boiling channels (12) to effect cooling of a coolant vapor which has entered the condenser (11) after being boiled from a liquid state in the boiling channels (12) as a result of the heat generated by one or more power modules affixed to an end plate (14) by any suitable means and to provide a parallel heat transfer path which shares the heat transfer task with the reflux cooling during normal system operation and which provides emergency heat transfer when reflux cooling is not available.

Abstract: A compact, lightweight, high current, feed-through capacitor for variable speed constant frequency aircraft power systems to provide filtering for unwanted higher harmonics and electromagnetic interference produced by the systems which provides a high temperature, high current feed-through capacitor having a hollow conductive housing, a conductive feed-through stud within the housing, an annular capacitive element for conducting electrical energy, and an electrical coupling, comprising a first conductor composed between an outer surface of the stud and an inner surface of the capacitive element, the first conductor providing an electrical path from the stud to the capacitive element for electrical energy present in the stud and a second conductor disposed radially between an outer surface of the capacitive element and an inner surface of the housing, the second conductor providing an electrical path for the electrical energy conducted by the capacitive element from the stud.

Abstract: Electrical devices which generate different amounts of heat are selectively cooled with a heat exchanger having a first portion formed of a fin-type heat exchanger and a second portion formed of a compact high intensity cooler wherein a jet impingement cooling mechanism is employed. Cooling fluid is circulated through the respective cooling mechanisms which can be arranged in series or parallel for differentially cooling respective electrical devices placed in contact with respective portions of an outer surface of the heat exchanger.

Abstract: A method of manufacturing hermetically sealed circuit assemblies (10) having circuit elements (74, 76, 78 and 80) to be compression bonded, a hermetically sealed circuit assembly having circuit elements to be compression bonded and a stack containing at least one hermetically sealed circuit assembly having circuit elements which are compression bonded is disclosed. Uniform thickness of individual hermetically sealed circuit assemblies measured across columns (22-30) is insured by positioning deformable spacers (124-132) in the columns containing the circuit elements to be compression bonded, and deforming the deformable spacers so that a surface of each of the deformed spacers lies within a single plane. Thereafter a compressive force is applied to a stack of one or more circuits through the columns which contain the circuit elements to be compression bonded.

Abstract: An integrated evaporator and thermal expansion valve assembly for use in a refrigeration system. An evaporator includes a housing defining an inlet header and an outlet header. A valve is mounted on the housing in communication with the inlet header for controlling the flow of refrigerant to the evaporator of the refrigeration system. A pressure and temperature resonsive sensing bulb assembly is mounted on the housing in communication with the outlet header for responding to the superheat temperature in the outlet header of the evaporator for opening the valve when the superheat temperature increases and for responding to the pressure in the refrigeration system for closing the valve when the pressure increases to offset a portion of the effect of the temperature response on the valve.