Abstract: A relatively thin superconductive magnetic shield, as of lead, is supported from a hollow support structure, as of aluminum or fiberglass by means of a multiplicity of spots of adhesive, as of epoxy, serving to bond the superconducting shield to the support structure. The shield and support structure is then positioned within a reentrant cryostat and cooled to liquid helium temperature to render the shield superconductive. Adjacent edges of the shield material are outwardly flanged and sealed together at the flanged portions, as by welding. The spot pattern of adhesive permits the shield to flex during thermal cycling to relieve strain and prevent fracture thereof while at the same time supporting the shield in a substantially nonmicrophonic manner.