Abstract: The invention is a grounding/positioning clip for providing a DC ground return path, low inductance AC ground path between circuit boards and for positioning electronic components in relation to an electronic device. The assembly includes a heat spreader with an electronic device mounted thereon. The leads of the electronic device are physically and electrically attached to first and second circuit boards. A clip, which has electronic components mounted thereon, fits over the electronic device thereby positioning the electronic components in correct physical relationship to the electronic device and the first and second circuit boards. Also the clip acts as a low inductance AC ground path between the first and second circuit boards and also provides a DC ground path. Preferrably the electronic device is a power transistor and the electronic components mounted on the clip are miniature compression mica capacitors for RF matching.