Abstract: Wax-based compositions for making barrier layers used in oral treatment devices are thermally stable when formed into a flat sheet or three-dimensional article to a temperature of at least 45° C. and are plastically deformable at room temperature (25° C.). The wax-based compositions include a wax fraction homogeneously blended with a polymer fraction. The wax fraction includes at least one wax and the polymer fraction includes at least one polymer selected such that, when the at least one wax and at least one polymer are homogeneously blended together, they yield a wax-based composition having the desired properties of thermal stability and plastic deformability. Barrier layers and oral treatment devices made from such wax-based compositions are dimensionally stable to a temperature of at least 40° C. without external support and can be plastically deformed in a user's mouth to become at least partially customized to the size and shape of user's unique dentition.

Abstract: Wax-based compositions for making barrier layers used in oral treatment devices are thermally stable when formed into a flat sheet or three-dimensional article to a temperature of at least 45° C. and are plastically deformable at room temperature (25° C.). The wax-based compositions include a wax fraction homogeneously blended with a polymer fraction. The wax fraction includes at least one wax and the polymer fraction includes at least one polymer selected such that, when the at least one wax and at least one polymer are homogeneously blended together, they yield a wax-based composition having the desired properties of thermal stability and plastic deformability. Barrier layers and oral treatment devices made from such wax-based compositions are dimensionally stable to a temperature of at least 40° C. without external support and can be plastically deformed in a user's mouth to become at least partially customized to the size and shape of user's unique dentition.

Abstract: A box-type warewasher includes a housing defining an internal treatment space for receiving wares to be washed and a liquid sump below the treatment space. A wash liquid delivery system includes a wash pump having an input connected to the liquid sump and an output connected to deliver liquid to one or more spray nozzles of the treatment space. A rinse liquid delivery system includes a rinse pump for delivering rinse water to one or more spray nozzles of the treatment space. A condensing system includes a heat exchanger external of the treatment space, and a blower for moving hot moist air from the treatment space across the heat exchanger and back to the treatment space. A controller effects operation of each of the wash liquid delivery system, the rinse liquid deliver system and the condensing system.

Abstract: A method and system for publishing a media set. The method includes selecting a publishing platform, compiling a set of data regarding the media set, analyzing the set of data, creating a playlist based on the analyzing the set of data for said media set, and publishing the media set on the publishing platform.

Abstract: An apparatus for manipulating the temperature of a sample used in focused ion beam FIB processing includes a base member, a thermoelectric module disposed over the base member, and a sample mounted on a mounting surface of the thermoelectric module. The thermoelectric module is configured so as to reduce the temperature of the sample with respect to an ambient FIB tool temperature.

Abstract: A method of repairing a semiconductor chip containing copper is taught, whereby copper is selectively removed from the chip. The method involves processing the chip inside a chamber in which the chip is exposed to various gases and an energy source, such as a focused ion beam. To the extent the chip may have non-copper materials, such as nitride and oxide layers, on top of the copper that is to be removed, those non-copper materials will first be selectively removed. Such removal typically results in a hole (a so-called “elevator shaft”) leading to the copper that is to be removed. Next, the method teaches the introduction of a combination of nitrogen and oxygen into the chamber and the directing of the ion beam at the spot where the copper is to be removed. In this manner, the copper on the chip is cleanly and reliably removed, without causing damage to the processing chamber.

Abstract: A method and structure for a sample processing apparatus that uses a vacuum enclosure is disclosed. A focused ion beam tool, sputter target, movable stage, and hinged mount are all included within the vacuum enclosure. The hinged mount includes a sample mounting portion, for holding a sample being processed in the vacuum enclosure, and a counterweight portion. The counterweight portion is connected to the sample mounting portion at an approximate right angle to the sample mounting portion. More specifically, one end of the sample mounting portion is connected to one end of the counterweight portion, such that the sample mounting portion and the counterweight portion form an approximate right angle. There is also an axis around which the mount rotates. The axis passes through the sample mounting portion and the counterweight portion at a location where the sample mounting portion and the counterweight portion connect to one another.

Abstract: A method of repairing a semiconductor chip containing copper is taught, whereby copper is selectively removed from the chip. The method involves processing the chip inside a chamber in which the chip is exposed to various gases and an energy source, such as a focused ion beam. To the extent the chip may have non-copper materials, such as nitride and oxide layers, on top of the copper that is to be removed, those non-copper materials will first be selectively removed. Such removal typically results in a hole (a so-called “elevator shaft”) leading to the copper that is to be removed. Next, the method teaches the introduction of a combination of nitrogen and oxygen into the chamber and the directing of the ion beam at the spot where the copper is to be removed. In this manner, the copper on the chip is cleanly and reliably removed, without causing damage to the processing chamber.

Abstract: A particulate food product is indirectly heated to at least about 170.degree. after steam is directly injected onto the particulate food product to provide a moist environment and surface moisture on the particulate food product. The indirect heating is continued for a time and temperature to reduce the microbial contamination of the particulate cereal and/or legume products by an amount of at least log 2 without the loss of the functional properties.

Abstract: A solar heating device for the cooking of food, consisting of a parabolic trough reflector and having support legs attached at the approximate center of gravity of the reflector and oven assembly. The reflector longitudinal supports serving to hold a cooking oven consisting of a bottom of transparent plastic and a detachable top made of insulation and lined inside with a reflective material. The items to be cooked are supported inside the oven by means of a skewer or a skewer supported pan. The reflector assembly also having an aiming device mounted on it's perpendicular support to assure reflector focus by means of shadows.