Abstract: Embodiments of the present disclosure describe apparatuses, methods, and systems of an integrated circuit (IC) device. The IC device may include a thermal spreader having graduated thermal expansion parameters. In some embodiments, the thermal spreader may have a first layer with a first coefficient of thermal expansion (CTE) and a second layer with a second CTE that is greater than the first CTE. Other embodiments may be described and/or claimed.

Abstract: A compact heat exchanger increases the cooling capacity within existing sizes of electronics cabinets. The heat exchanger includes a core having multiple thermally conductive members defining internal and external pathways. The internal pathways define inlets for receiving fluid from and outlets for passing fluid to the inside of the enclosure. The external pathways define inlets for receiving fluid from and outlets for passing fluid to the outside of the enclosure. The heat exchanger further includes an external pathway fluid driving mechanism coupled to the core in fluid flow relationship with the external pathways that causes fluid to flow in a first direction through the external pathways and an internal pathway fluid driving mechanism coupled to the core in fluid flow relationship with the internal pathways that causes fluid to flow in a second direction through the internal pathways in a manner facilitating heat exchange by the multiple thermally conductive members.

Abstract: A cabinet which utilizes an air-to-air heat exchanger to remove heat generated from within the cabinet prevents water and dust from entering the air-to-air heat exchanger by forcing cooler external air up along a first side wall, through the air-to-air heat exchanger, and down along a second side wall.

Abstract: The efficiency of a heat exchanger is significantly improved by connecting walls to an air flow structure, which has first grooves formed in the top surface of the structure and second grooves formed in the bottom surface of the structure, that block off alternating ends of the first and second grooves such that a first air source can only flow through the first grooves and a second air source can only flow through the second grooves.

Abstract: An air-to-air heat exchanger is simply and easily installed in an electronics cabinet in the field by using a template to form an air exit opening that corresponds with an air inlet opening of the heat exchanger, and an air inlet opening that corresponds with an air exit opening of the heat exchanger. Once the openings have been formed, the heat exchanger is mounted to the outside of the cabinet, such as on a side wall or a door of the cabinet.