Patents by Inventor Lawrence Grunert

Lawrence Grunert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS package and a method for manufacturing the same
    Patent number: 9399574
    Abstract: A plurality of MEMS transducer packages is manufactured by placement of a plurality of transducers onto a panel of undivided package substrates, attachment of a plurality of individual covers onto a panel and over the transducers, depositing an epoxy into the channels between the covers, and then singulating the panel into individual MEMS transducer packages.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: July 26, 2016
    Assignee: Knowles Electronics LLC
    Inventors: Peter V. Loeppert, Denise P. Czech, Lawrence A. Grunert, Kurt B. Friel, Qing Wang
  • MEMS Package And A Method For Manufacturing The Same
    Publication number: 20150166335
    Abstract: A plurality of MEMS transducer packages is manufactured by placement of a plurality of transducers onto a panel of undivided package substrates, attachment of a plurality of individual covers onto a panel and over the transducers, depositing an epoxy into the channels between the covers, and then singulating the panel into individual MEMS transducer packages.
    Type: Application
    Filed: February 26, 2015
    Publication date: June 18, 2015
    Inventors: Peter V. Loeppert, Denise P. Czech, Lawrence A. Grunert, Kurt B. Friel, Qing Wang
  • MEMS package and a method for manufacturing the same
    Patent number: 8987030
    Abstract: A method is provided for manufacturing a plurality of packages. The method comprises the steps of: applying a means for adhering two or more covers to a substrate; positioning the two or more covers onto the substrate to create one or more channels bounded by the two or more covers and the substrate; coupling the covers to the substrate; depositing a material into the one or more channels; performing a process on the material to affix the material; and singulating along the channels to create the plurality of packages.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: March 24, 2015
    Assignee: Knowles Electronics, LLC
    Inventors: Peter V. Loeppert, Denise P. Czech, Lawrence A. Grunert, Kurt B. Friel, Qing Wang
  • Package with a CMOS die positioned underneath a MEMS die
    Patent number: 8791531
    Abstract: A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate.
    Type: Grant
    Filed: October 21, 2011
    Date of Patent: July 29, 2014
    Assignee: Knowles Electronics, LLC
    Inventors: Peter V. Loeppert, David Giesecke, Anthony Minervini, Jeffrey Niew, Lawrence Grunert
  • Package With A CMOS Die Positioned Underneath A MEMS Die
    Publication number: 20120161259
    Abstract: A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate.
    Type: Application
    Filed: October 21, 2011
    Publication date: June 28, 2012
    Inventors: Peter V. Loeppert, Daniel Giesecke, Anthony Minervini, Jeffrey Niew, Lawrence Grunert
  • MEMS PACKAGE AND A METHOD FOR MANUFACTURING THE SAME
    Publication number: 20110039372
    Abstract: A method is provided for manufacturing a plurality of packages. The method comprises the steps of: applying a means for adhering two or more covers to a substrate; positioning the two or more covers onto the substrate to create one or more channels bounded by the two or more covers and the substrate; coupling the covers to the substrate; depositing a material into the one or more channels; performing a process on the material to affix the material; and singulating along the channels to create the plurality of packages.
    Type: Application
    Filed: August 13, 2010
    Publication date: February 17, 2011
    Inventors: Peter V. Loeppert, Denise P. Czech, Lawrence A. Grunert, Kurt B. Friel, Qing Wang