Abstract: An apparatus and method for providing electrical contact between an array of fingers of a tape automated bonding frame and a corresponding array of raised contact areas on a substrate. The tape automated bonding frame is preferably a multi-metal member having at least one utility plane. A load plate having downwardly projecting regions is pressed onto the tape automated bonding frame on a side opposite to the substrate. The substrate may be a printed circuit board and the raised contact areas may be conductive pads. The ends of the fingers of the tape automated bonding frame are precisely aligned with the raised contact areas of the substrate. The downwardly projecting regions of the load plate are generally rigid and provide a compression force between adjacent contact areas and between adjacent finger ends.

Abstract: An electronic packaging module in which the inactive sides of integrated circuit chips are held in compression against a heat spreader by an elastomer pressed thereagainst by a multilayer flexible printed circuit board. A TAB frame, which may be demountable, interconnects integrated circuit chips to a multilayer flexible printed circuit board. A backing plate is fastened to a heat spreader so that it presses against the multilayer flexible printed circuit board. Contacts are compressed against the motherboard to interconnect the multilayer flexible printed circuit board thereto. Coaxial power connectors provide power and ground connections between non-peripheral portions of the multilayer flexible printed circuit board and the motherboard.