Abstract: A plastic card, including a bottom overlay, a top overlay positioned above a top surface of the bottom overlay and a core layer positioned between the top surface of the bottom overlay and the top overlay. A method for manufacturing a plastic card, including loading a bottom overlay into an injection molding apparatus, loading a top overlay into the injection molding apparatus wherein the top overlay is positioned above a top surface of the bottom overlay and injecting a core layer between the bottom overlay and top overlay, wherein one or more protrusions are formed on the surface of the top overlay. The protrusions may be arranged in such a way as to form designs on the surface of the plastic card.

Abstract: A RFID power bracelet and a method for manufacturing the same is provided. The bracelet is composed of a bottom layer having a top surface and a bottom surface, a power source attached to the top surface of the bottom layer, a core layer, positioned above the bottom layer and attached to the bottom layer and a top layer, positioned above the core layer, wherein the top layer is configured to receive a detachable electronic package capable of operatively connecting to the power source.

Abstract: A battery powered device is composed of a plurality of circuit components, including a battery. The perimeter of the battery is enclosed by a protective frame. Alternatively, a protective member is positioned inside the battery. The protective frame/member makes the battery resistant to being severely damaged by tearing or cutting forces commonly used in the destruction and disposal of battery powered devices.

Abstract: A battery powered device is composed of a plurality of circuit components, including a battery. The perimeter of the battery is enclosed by a protective frame. The protective frame prevents the battery from being severely damaged by tearing or cutting forces commonly used in the destruction and disposal of battery powered devices.

Abstract: An embedded electronic device and a method for manufacturing the same wherein the embedded electronic device is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board having a plurality of standoffs on the bottom surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay.