Patents by Inventor Lawrence K. Takvorian

Lawrence K. Takvorian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for soldering void-free joints
    Patent number: 4860942
    Abstract: A process for soldering without using flux and producing a void-free joint comprises the steps of melting the solder in a reducing gas atmosphere such as hydrogen, evacuating the gas to permit the solder joint to expell any trapped gas, then reintroducing the reducing gas and cooling the solder joint. The reducing gas obviates the use of flux to avoid oxidation from interfering with the wetting of the materials to be joined. The materials may be metalized prior to soldering to permit wetting of certain materials such as ceramic.
    Type: Grant
    Filed: November 30, 1987
    Date of Patent: August 29, 1989
    Assignee: Ceradyne, Inc.
    Inventor: Lawrence K. Takvorian