Abstract: Suture anchors for securing therapy delivery elements, such as stimulation leads or catheters, within a living body. The suture anchor includes an inner sleeve constructed with an inner layer of a softer, more pliable material that easily conforms to the therapy delivery element to reduce slippage and an outer layer constructed from a harder, stiffer durometer material that protects the therapy delivery elements from damage due to over-tightening the tie down sutures. A suture material located in the suture groove is tensioned to apply a radial compressive force. The reinforcing structure spreads the radial compressive force along a greater surface area of the therapy delivery element.

Abstract: An apparatus for electrical inspection is disclosed. The apparatus comprises an inert gas delivery system that delivers inert gas near a microscope imaging element and electrical test probes. A gas supply provides an inert gas such as argon or nitrogen. The inert gas displaces oxygen to prevent premature oxidation of the test probes. In one embodiment, one or more delivery tubes deliver inert gas to the measurement area.

Abstract: A therapy assembly configured for at least partial insertion in a living body. A plurality of fixation structures are disposed radially around the therapy delivery element proximate the electrodes. The fixation structures include wires having a diameter in a range between about 0.004 inches and about 0.020 inches. The wires have a first end attached to the therapy delivery element and a second end attached to a sliding member configured to slide along the therapy delivery element. The fixation structures are configured to collapse inward to a collapsed configuration when inserted into a lumen of an introducer and to deploy to a deployed configuration when the introducer is retracted. A fitting is located at proximal end of the introducer that releasably locks the therapy delivery element to the introducer, such that torque applied to the fitting is substantially transmitted to the distal end of the therapy assembly.

Abstract: A therapy assembly configured for at least partial insertion in a living body. At least one fixation structure is attached to the therapy delivery element proximate the electrodes. The fixation structure is configured to collapse radially inward and wrap circumferentially around the therapy delivery element to a collapsed configuration when inserted into a lumen of an introducer. The fixation structures deploy to a deployed configuration when the introducer is retracted. The fixation structure includes major surfaces generally parallel with, and extending radially outward from, a central axis of the therapy delivery element, proximal edge surface oriented toward the proximal end, and a distal edge surface oriented toward the distal end. The proximal and distal edge surfaces provide generally symmetrical resistance to displacement of the therapy delivery element within the living body in either a proximal direction or a distal direction along the central axis.

Abstract: A lead identification system for tracking a plurality of neurostimulation leads during implantation in a patient, and a method of using the same. The lead identification system includes a plurality of lead indicators each adapted to attach to one of a plurality of epidural needles to identify the leads. At least one clip adapted to releasably attach to proximal ends of the leads is provided with corresponding lead indicators. The trial cable for conducting trial stimulation includes connectors with corresponding lead indicators. A plurality of lead indicator stylets are provided for insertion into lumens at the proximal ends of the leads. The pulse generator also has connectors with corresponding lead indicators. The various lead indicators permit a surgeon to track a particular lead to the corresponding connectors on the pulse generator.

Abstract: A stylet-lead assembly including a therapy delivery element and a stylet. The therapy delivery element includes a proximal end with a plurality of electrical contacts adapted to electrically couple with an implantable pulse generator, a distal end with a plurality of electrodes electrically coupled to the electrical contacts, and a lumen having a lumen length extending from the proximal end to almost the distal end. The stylet handle includes a locking insert has a first channel adapted to receive the proximal end of the stylet wire. The portion of the stylet wire extending beyond a proximal end of the locking insert includes at least one bend. A stylet handle has an opening at a distal end adapted to compressively engage the proximal end of the stylet wire to the locking insert, such that an exposed portion of the stylet wire measured from the distal end of the stylet wire to a distal end of the locking insert generally comprises the lumen length.

Abstract: A lead identification system for tracking a plurality of neurostimulation leads during implantation in a patient, and a method of using the same. The lead identification system includes a plurality of lead indicators each adapted to attach to one of a plurality of epidural needles to identify the leads. At least one clip adapted to releasably attach to proximal ends of the leads is provided with corresponding lead indicators. The trial cable for conducting trial stimulation includes connectors with corresponding lead indicators. A plurality of lead indicator stylets are provided for insertion into lumens at the proximal ends of the leads. The pulse generator also has connectors with corresponding lead indicators. The various lead indicators permit a surgeon to track a particular lead to the corresponding connectors on the pulse generator.

Abstract: Suture anchors for securing therapy delivery elements, such as stimulation leads or catheters, within a living body. The suture anchor includes an inner sleeve constructed with an inner layer of a softer, more pliable material that easily conforms to the therapy delivery element to reduce slippage and an outer layer constructed from a harder, stiffer durometer material that protects the therapy delivery elements from damage due to over-tightening the tie down sutures. A suture material located in the suture groove is tensioned to apply a radial compressive force. The reinforcing structure spreads the radial compressive force along a greater surface area of the therapy delivery element.

Abstract: A suture anchor for securing a therapy delivery element in a desired location within a living body using a suture material. The suture anchor includes an inner sleeve with a primary lumen sized to receive the therapy delivery element. The inner sleeve includes a compliant material having a first durometer. An anchor body extends around at least a portion of the inner sleeve and includes a portion of the primary lumen. The anchor body includes a compliant material having a second durometer less than the first durometer. At least one exterior suture groove is located on the anchor body to receive the suture material. The exterior suture groove extends substantially to the inner sleeve so the suture material engages directly with the inner sleeve.

Abstract: An apparatus for electrical inspection is disclosed. The apparatus comprises an inert gas delivery system that delivers inert gas near a microscope imaging element and electrical test probes. A gas supply provides an inert gas such as argon or nitrogen. The inert gas displaces oxygen to prevent premature oxidation of the test probes. In one embodiment, one or more delivery tubes deliver inert gas to the measurement area.

Abstract: Methods of etching a semiconductor structure using ion milling with a variable-position endpoint detector to unlayer multiple interconnect layers, including low-k dielectric films. The ion milling process is controlled for each material type to maintain a planar surface with minimal damage to the exposed materials. In so doing, an ion beam mills a first layer and detects an endpoint thereof using an optical detector positioned within the ion beam adjacent the first layer to expose a second layer of low-k dielectric film. Once the low-k dielectric film is exposed, a portion of the low-k dielectric film may be removed to provide spaces therein, which are backfilled with a material and polished to remove the backfill material and a layer of the multiple interconnect metal layers. Still further, the exposed low-k dielectric film may then be removed, and the exposed metal vias polished.

Abstract: Low-k dielectric materials have desirable insulating characteristics for use in insulating sub micron conductors in semiconductor devices. However, certain physical and material characteristics of the low-k dielectric materials make them difficult to work with. More particularly, the soft, porous, leakage-prone characteristics of low-k materials makes it difficult to accommodate electrical contacts for electrical probing to conductors covered by such materials. The present invention provides methods and structures for facilitating the electrical probing of semiconductor device conductors insulated by overlying low-k layers of dielectric material.

Abstract: Low-k dielectric films such as SiLK are desirably used in semiconductor structures, for example in back-end multilevel metal interconnect structures, as insulators. Low-k dielectric films, however, are prone to damage in the course of typical rework processes such as chemical-mechanical polishing, plasma/reactive ion etching, or wet chemistry processing/etching. The present invention uses an ion milling process with a variable-position endpoint detector to unlayer multiple layers including low-k dielectric films. The ion milling process can be controlled for each material type so as to maintain a planar surface with minimal or no damage to the exposed materials.

Abstract: Low-k dieclectric materials have desirable insulating characteristics for use in insulating sub micron conductors in semiconductor devices. However, certain physical and material characteristics of the low-k dielectric materials make them difficult to work with. More particularly, the soft, porous, leakage-prone characteristics of low-k materials makes it difficult to accommodate electrical contacts for electrical probing to conductors covered by such materials. The present invention provides methods and structures for facilitating the electrical probing of semiconductor device conductors insulated by overlying low-k layers of dielectric material.

Abstract: The present invention utilizes a reducing plasma treatment step to enhance the adhesion of a subsequently deposited inorganic barrier film to a copper wire or via present in a semiconductor interconnect structure such as a dual damascene structure. Interconnect structure including a material layer of Cu, Si and O, as essential elements, is formed between said copper wire or via and the inorganic barrier film.

Abstract: The present invention utilizes a reducing plasma treatment step to enhance the adhesion of a subsequently deposited inorganic barrier film to a copper wire or via present in a semiconductor interconnect structure such as a dual damascene structure. Interconnect structure comprising a material layer of Cu, Si and O, as essential elements, is formed between said copper wire or via and the inorganic barrier film.

Abstract: The present invention utilizes a reducing plasma treatment step to enhance the adhesion of a subsequently deposited inorganic barrier film to a copper wire or via present in a semiconductor interconnect structure such as a dual damascene structure. Interconnect structure comprising a material layer of Cu, Si and O, as essential elements, is formed between said copper wire or via and the inorganic barrier film.