Patents by Inventor Lawrence L. Bullock

Lawrence L. Bullock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flex to flex soldering by diode laser
    Patent number: 6833526
    Abstract: A method to solder flex circuits by diode laser. First and second flex circuits composed of polymer flex substrate are provided. Each flex circuit has a top and a bottom side and at least one contact trace embedded in its surface. An area of solder is provided on the contact trace of at least one of the flex circuits and the flex circuits are positioned so that the contact traces of each flex circuit are substantially aligned. A laser beam is positioned to heat the contact trace to melt the solder and fuse the contacts.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: December 21, 2004
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Peter J. Sinkunas, Zhong-You Shi, Lawrence L. Bullock
  • Flex to flex soldering by diode laser
    Publication number: 20030019846
    Abstract: A method to solder flex circuits by diode laser. First and second flex circuits composed of polymer flex substrate are provided. Each flex circuit has a top and a bottom side and at least one contact trace embedded in its surface. An area of solder is provided on the contact trace of at least one of the flex circuits and the flex circuits are positioned so that the contact traces of each flex circuit are substantially aligned. A laser beam is positioned to heat the contact trace to melt the solder and fuse the contacts.
    Type: Application
    Filed: March 28, 2001
    Publication date: January 30, 2003
    Inventors: Peter J. Sinkunas, Zhong-You Shi, Lawrence L. Bullock